Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Bunta Okamoto

Kuniaki Yosui

Yuki Wakabayashi

Noboru Kato

Naoto Ikeda

Isamu Morita

Takeshi Kurihara

Jun Sasaki

Yoshihito Otsubo

Norio Sakai

Satoshi Ishino

Satoshi Sasaki

Keisuke Araki

Motoyoshi Sakai

Hidekazu Oishibashi

An inductor bridge includes an inductor in a flexible, flat plate-shaped element body including resin bases that are laminated, and a wiring unit connected in series to the inductor. The inductor includes wound conductor patterns, each with a winding axis in a laminating direction of the resin bases and respectively provided on each of the resin bases, and an interlayer connection conductor interlayer-connecting the wound conductor patterns. The wiring unit includes a wiring pattern at a layer between a first surface of the wound conductor pattern and a layer farthest from the first surface and interlayer connection conductors conducted to the wiring pattern.

Inductor bridge and electronic device

An electronic device includes an inductor bridge that connects first and second circuits. The inductor bridge includes an insulating base material and a conical coil in the insulating base material. The conical coil includes loop shaped conductors arranged in a winding axis direction. Inner and outer diameters of the loop shaped conductors change is one way in the winding axis direction. A large-diameter loop shaped conductor, which is one of the loop shaped conductors that has the largest inner and outer diameters, is disposed such that the inner and outer diameters thereof relatively extend along the insulating base material compared with the other loop shaped conductors when the inductor bridge is bent.

Electronic device

An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.

An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.

Electrical element, mobile device, and method for manufacturing electrical element

A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.

Multilayer circuit board using laser direct structuring additive

A crystal vibrating device that includes a crystal resonator mounted on a substrate by a first conductive adhesive layer and a second conductive adhesive layer, and, when the first conductive adhesive layer and the second conductive adhesive layer are viewed in a plan view, the first conductive adhesive layer and the second conductive adhesive layer each have a) a planar shape in which two circles or ellipses are partly superimposed upon each other, b) two conductive adhesive layer portions that are separated from each other, or c) a length direction and an aspect ratio, which is a ratio between a maximum size in the length direction and a maximum size in a width direction that is orthogonal to the maximum size in the length direction, is in a range of 1.5 to 3.0.

Crystal vibrating device and method for producing the same

A piezoelectric vibration component that includes a sealed space formed between first and second package members, and a piezoelectric vibrator is bonded to the first package member with first and second conductive adhesive portions. In the piezoelectric vibrator, a first vibration electrode and a first extended electrode are formed on a first surface of a piezoelectric substrate, and a second vibration electrode and a second extended electrode are formed on a second surface of the piezoelectric substrate. At least the second extended electrode provided on the second principal surface has a higher bonding strength with respect to the conductive adhesive than that of the electrodes on the first principal surface. The electrode patterns on the first and second principal surfaces differ from each other so that the first surface and the second surface can be distinguished from each other.

Piezoelectric vibration component having distinguishable opposing principal surfaces

A high-frequency signal line includes a dielectric base with a first line portion and a second line portion each extending along a predetermined straight line parallel or substantially parallel to a predetermined direction, and a third line portion mutually connecting first side ends of the first line portion and the second line portion in the predetermined direction, a signal line, a first ground conductor located on the first side in the layer stacking direction of the signal line, a second ground conductor located on a second side in the layer stacking direction of the signal line, and one or more interlayer connection conductors connecting the first ground conductor and the second ground conductor. In the third line portion, the interlayer connection conductor is provided on the second side in the predetermined direction of the signal line when viewed from the layer stacking direction.

High-frequency signal line and electronic device provided with the same

A high-frequency signal transmission line includes a plate-shaped dielectric element assembly, a linear signal line, and a first ground conductor. The linear signal line is provided at the dielectric element assembly and includes a plurality of thick portions and a plurality of thin portions with a smaller width than the thick portions. The first ground conductor is provided at the dielectric element assembly and positioned on one side in a normal direction to the dielectric element assembly relative to the signal line. The first ground conductor includes a plurality of openings overlapping with the signal line and also includes bridge portions provided between the openings so as to cross the thin portions. The bridge portions cross the thin portion obliquely when viewed in a plan view in the normal direction to the dielectric element assembly.

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Nagaokakyo, Japan

Bunta Okamoto