Stats Chippac Pte. Ltd.

BumJoon Hong

Jong-Woo Ha

Soo-San Park

Sang-Ho Lee

Flynn P Carson

SeongMin Lee

DaeSik Choi

A stacked integrated circuit package system includes: providing a base integrated circuit package, and mounting a top integrated circuit package having a top interposer and a top encapsulation with a cavity therein or the cavity as a space between top intra-stack interconnects and the top interposer, with the top interposer exposed by the cavity, over the base integrated circuit package.

Stacked integrated circuit package system

An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; connecting a first device to the first lead-finger system with a wire bond; stacking a second device over the first device; and connecting the second device to the second lead-finger system with a bump bond.

Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires

A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof

A method for manufacturing of an integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof

A method for manufacturing of a stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer; and mounting a top integrated circuit package over the intermediate integrated circuit package.

Stacked integrated circuit package system and method for manufacturing thereof

Integrated circuit package system employing an offset stacked configuration

An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

Integrated circuit package-in-package system with side-by-side and offset stacking

A stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer, and mounting a top integrated circuit package over the intermediate integrated circuit package.

An integrated circuit package system comprising: providing a module lead array; attaching a module integrated circuit adjacent the module lead array; attaching a module substrate over the module integrated circuit; and applying a module encapsulant over the module integrated circuit wherein the module lead array and the module substrate are partially exposed.

Integrated circuit package system with stacking module

An integrated circuit package-in-package system includes: mounting an integrated circuit device over a package carrier; forming a subassembly including: providing an integrated circuit package system having a carrier interposer with an integrated circuit die thereover, and mounting a device under the carrier interposer; mounting the subassembly over the integrated circuit device; and encapsulating the subassembly and the integrated circuit device over the package carrier.

Growing community of inventors

Seoul, South Korea

BumJoon Hong