Samsung Electro-mechanics Co., Ltd.

Bum Suk Kang

Jeong Ryeol Kim

Da Mi Kim

Dae Woo Yoon

Su Jin Lee

Chang Hoon Kim

Hang Kyu Cho

Seong Han Park

Hyo Min Kang

Doo Young Kim

Dong Hoon Kim

Hew Young Kim

A multilayer electronic component is provided, the multilayer electronic component, including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction, the body having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the third and fourth surfaces of the body and connected to the internal electrodes. At least one of the internal electrodes includes an interfacial layer disposed on at least a portion of a region connected to the external electrode, and the interfacial layer includes an oxide containing Fe.

Multilayer electronic component having moisture-and hydrogen-resistant interfacial structure

A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.

Multilayer electronic component

A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.

Capacitor component and paste for external electrode

A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.

Ceramic electronic component including bonding layer between body and sintered external electrode

An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.

Electronic component

A manufacturing method of an electronic component includes forming a body including first and second internal electrodes respectively exposed from first and second end surfaces of the body and dielectric layers disposed between the first and second internal electrodes; applying, on the first and second end surfaces of the body, a paste containing a metal powder and first glass; and sintering the body and the paste to convert the paste to first and second external electrodes including crystalline metal particles having a polyhedral shape and second glass and respectively connected to the first internal electrodes and the second internal electrodes

Manufacturing method of electronic component

There are provided a conductive paste for external electrodes and a multilayer ceramic electronic component using the same. The conductive paste includes a conductive metal powder including conductive metal particles; and a conductive amorphous metal powder including amorphous metal particles having a(Si, B)-b(Li, K)-c(V, Mn) in which a+b+c=100, 20&#x2266;a&#x2266;60, 10&#x2266;b&#x2266;40, and 2&#x2266;c&#x2266;25 are satisfied.

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Gyunggi-do, South Korea

Bum Suk Kang