Samsung Electronics Co., Ltd.

Bum-kyoo Choi

Jong-woo Shin

Yong-Kweon Kim

A deformable mirror device and manufacturing method therefore. The method includes the steps of forming an electrode layer on a substrate in a predetermined pattern, forming a thick film on the upper surfaces of the substrate and the electrode layer, forming a support plate on the upper surface of the thick film, and partially etching the thick film to form at least one through hole. The method further includes separating the support plate into single portions, forming a post on one side of the inner surface of the through hole, forming a reflecting plate on the upper surface of the support plate, and removing the thick film.

Deformable mirror device and manufacturing method thereof

A deformable mirror device and manufacturing method therefor. The method includes the steps of forming an electrode layer on a substrate in a predetermined pattern, forming a thick film on the upper surfaces of the substrate and the electrode layer, forming a support plate on the upper surface of the thick film, and partially etching the thick film to form at least one through hole. The method further includes separating the support plate into single portions, forming a post on one side of the inner surface of the through hole, forming a reflecting plate on the upper surface of the support plate, and removing the thick film.

A deformable mirror device and a manufacturing method thereof, which decreases the possibility of damage to a substrate having an address scanning circuit and increases the efficiency of light reflection of a moving mirror. First and second moving mirrors and first and second posts are fabricated on a substrate. An address scanning circuit (SRAM) is fabricated on another substrate, independently. Finally, both the substrates are combined. The second post is vertically formed by sputtering after the second moving mirror is formed.

Growing community of inventors

Seongnam, South Korea

Bum-kyoo Choi