Codenoll Technology Corporation

Bulusu V Dutt

Michael H Coden

Peter G Abbott

A star-coupler and a method for constructing the star-coupler employing injection molding technology are disclosed. The star-coupler may be constructed from a single injection molded block or a plurality of mating sections, and is supplied with a plurality of input ports and a plurality of output ports. Each input port as well as each output port is connected to at least one channel. The channels are filled with a fiber optical core material and the single block or mating sections are fabricated from fiber optical core material. Alternatively, a separate cladding material may be coated on the surfaces of the block or mating sections which define the channels. Optical signals are guided and confined by the core and cladding material from input ports to output ports along the channels.

Injection molded star-couplers and methods of making same

A fiber optic star-coupler with a biconical mixing element and method for inexpensively manufacturing the same are disclosed. The fiber optic star-coupler includes an input fiber optic bundle, an output fiber optic bundle and a biconical mixing element. Each of the bundles comprises a plurality of individual optical fibers. The biconical mixing element includes tapered regions and a central mixing zone to promote uniform mixing and equal distribution of optical energy among all of the optical fibers in the output fiber optic bundle. The biconical mixing element is provided with connectors at each of its two ends for coupling to other connectors, adaptors, and fiber optic bundles. Alternatively, the biconical mixing element may be formed by injection molding techniques. The optical fibers may be constructed from plastic or silica.

Star-couplers with biconical mixing elements and methods for making the

A shadow-masking process for manufacturing low dark current photodetectors with low noise characteristics is disclosed. The process includes shadow-masking a semiconductor wafer by positioning a patterned shadow-mask on a surface of the wafer. The shadow-mask is patterned with, for example, circular openings or stripe openings. Layers, such as metallization layers to form metallic contacts or anti-reflection layers are deposited onto the wafer through the patterned openings in the shadow-masks. This shadow-masking process may be used in the production of any semiconductor device requiring patterned layers.

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Yorktown Heights, NY, United States of America

Bulusu V Dutt