Samsung Display Co., Ltd.

Kyungpook National University Industry-Academic Cooperation Foundation

Buemjoon Kim

Jihoon Kim

Woong Sik Kim

Woong Bae Kim

Ho Jung Lee

Junho Sim

Hyungbo Shim

Kyungwon Kang

Jaeku Han

Teadong Kim

Hyoshin Song

Sungho Noh

Seungsik Ham

Heesuk Lee

A laser cutting apparatus includes a laser module, a vibration module, a motor module, a reflective module, and a concentrating module. The vibration module includes a lens module, and a piezoelectric module coupled to the lens module and configured to repeatedly expand and contract. The motor module is configured to move the vibration module in by transmitting power to the vibration module. The reflective module is configured to reflect the laser beam in such a way that a traveling direction of the laser beam is changed. The concentrating module is configured to concentrate the laser beam in such a way that energy of the laser beam reflected by the reflective surface is concentrated at a focal point.

Laser cutting apparatus

A substrate cutting device includes: a base portion; a stage on the base portion; a partition member spaced from the stage; and an exhausting structure below the cell substrate and configured to exhaust a gaseous substance. The stage has a top surface configured to support a cell substrate and a connection surface perpendicular to the top surface, and the partition member faces the connection surface and is configured to support the cell substrate.

Substrate cutting device

Growing community of inventors

Hwaseong-si, South Korea

Buemjoon Kim