Intel Corporation

Buck Gremel

David J Harriman

Robert G Blankenship

Krishnakanth Venkata Sistla

Jasmin Ajanovic

Blaise B Fanning

Ankush Varma

Tessil Thomas

Ian M Steiner

David M Lee

Eric R Wehage

Michael F Cole

Wayne Moore

Lokesh Sharma

Ken Creta

James W Alexander

Malay Trivedi

Mohan Nair

Peter N Martin

Pinkesh J Shah

In one embodiment, a processor includes at least one core to execute instructions, one or more thermal sensors associated with the at least one core, and a power controller coupled to the at least one core. The power controller has a control logic to receive temperature information regarding the processor and dynamically determine a maximum allowable average power limit based at least in part on the temperature information. The control logic may further maintain a static maximum base operating frequency of the processor regardless of a value of the temperature information. Other embodiments are described and claimed.

Controlling average power limits of a processor

Methods and apparatus relating to low-overhead utilization-aware link-width modulation to reduce power consumption in interconnects are described. In one embodiment, link width modulation logic adjusts the width of an interconnect link. More particularly, the link width modulation logic causes the interconnect link to transition from a first width to a second width based on comparison of a utilization value associated with the interconnect link against at least one of a plurality of utilization threshold values. Other embodiments are also disclosed and claimed.

Utilization-aware low-overhead link-width modulation for power reduction in interconnects

Methods and apparatus relating to low-overhead utilization-aware link-width modulation to reduce power consumption in interconnects are described. In one embodiment, a link width modulation logic adjusts the width of an interconnect link. More particularly, the link width modulation logic causes the interconnect link to transition from a first width to a second width based on comparison of a utilization value associated with the interconnect link against at least one of a plurality of utilization threshold values. Other embodiments are also disclosed and claimed.

An apparatus and method are disclosed to optimize the latency and the power of a link operating inside a processor-based system. The apparatus and method include a latency meter built into a queue that does not rely on a queue-depth threshold. The apparatus and method also include feedback logic that optimizes power reduction around an increasing latency target to react to sluggish re-provisioning behavior imposed by the physical properties of the link.

Method and apparatus for optimizing power and latency on a link

An enhanced general input/output (EGIO) communication architecture, protocol and related methods are presented. The elements of an EGIO architecture may include one or more of a root complex (e.g., implemented within a bridge), a switch, and end-points, each incorporating at least a subset of EGIO features to support EGIO communication between such elements.

General input/output architecture, protocol and related methods to manage data integrity

According to embodiments of the present invention, indicators on a PCI/PCI-X controlled by a Standard Hot-Plug Controller (SHPC) have non-fifty percent duty cycle blinking patterns that communicate to an operator a particular command being processed, whether the command was processed successfully, whether a 'hard' or 'soft' error occurred if the command was processed successfully, and whether power was applied to the slot if the command was not processed successfully.

Method for signaling PCI/PCI-X standard hot-plug controller (SHPC) command status

An enhanced general input/output communication architecture, protocol and related methods are presented. In one embodiment, a method is described comprising receiving a datagram at general input/output (GIO) interface from a remote GIO interface coupled through a GIO link, validating content of one or more packets embedded within the received datagram, and issuing an acknowledgment to the remote GIO interface that the datagram was successfully received on positive validation of the datagram before promoting the embedded packets to a transaction layer of the GIO interface. Other embodiments are also described.

Growing community of inventors

Olympia, WA, United States of America

Buck Gremel