Korea Institute of Ocean Science & Technology

Ulsan National Institute of Science and Technology

Sunny Wave Tech Co., Ltd.

Sunnywavetech

Bu Young Kim

Woo Seong Shim

Jin Woo Kong

Sang Heon Lee

Hak Sun Kim

Sung Hwan Park

Wang Kook Im

In order to solve the problems of a conventional flat surface wave generator which has limitations on being applied to a curved structure due to more than a certain required thickness of a dielectric material, proposed are a flexible surface wave generator and system and method for surface wave communication using the same where the flexible surface wave generator is bendable by removing a third dielectric material and by making a first and a second dielectric material thin and at the same time reaches communication performance applicable to the ISM band by changing a pattern of a surface wave generation member and by forming a slit in a radiator material, so it is possible to easily establish a surface wave communication system even in environments where a conventional flat surface wave generator is difficult to be applied by being tightly attached to the surface of a metal medium with curvature.

Flexible surface wave generator applicable to curved surfaces, and system and method for surface wave communication using same

A surface wave generator is proposed. The generator may include a radiator configured to generate an electromagnetic field based on a signal externally applied. The generator may also include a first dielectric substrate on a top of the radiator and a second dielectric substrate on a bottom of the radiator. The generator may further include a first surface wave generation member on a bottom of the second dielectric substrate, a first geometric pattern being deposited on a top of the first surface wave generation member. The generator may further include a third dielectric substrate on a bottom of the first surface wave generation member. The generator may also include a second surface wave generation member between the third dielectric substrate and a metal surface, a second geometric pattern different from the first geometric pattern and being deposited on an upper surface of the second surface wave generation member.

Surface wave generator attachable on ship metal body for communication

Disclosed is a method for producing a wafer map. More specifically, the present invention relates to: a method for producing a wafer map used for manufacturing chips in the semiconductor field, wherein a geographic information system (GIS) technique is used to produce the wafer map; and a method and system for providing wafer test results using same. According to an embodiment of the present invention, a semiconductor wafer is formed as a map by using the GIS technique, a coordinate system used in the GIS is utilized to create a map of the same size as an actual semiconductor wafer, and each of various constituent elements constituting the wafer can be stratified to reflect the actual size of the element to create a wafer map in which each of the elements is geocoded.

GIS-based method for producing spatial wafer map, and method for providing wafer test results using same

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Seoul, South Korea

Bu Young Kim