Siemens Energy, Inc.

Arkansas Power Electronics International, Inc.

Cree Fayetteville, Inc.

Rohm Co., Ltd.

Munters Corporation

Bryon Western

John Fraley

Roberto Marcelo Schupbach

David J Mitchell

Ramesh Subramanian

Anand A Kulkarni

Brice McPherson

Alexander B Lostetter

Edward R Roesch

Rod Waits

Cora Schillig

Jie Yang

Takukazu Otsuka

Brandon Passmore

Zach Cole

Edgar Cilio

Cora Hitchman

Roberto Schupbach

John R Fraley

David J Mitchel

A method and system can measure the weight of a bulk material within a container by applying excitation in the form of vibrational energy and interpreting the container's response to the vibration.

Method and apparatus to non-intrusively measure the weight of loose bulk material within a rigid containing structure

Provided is a double-sided cooling structure for a semiconductor device using a low processing temperature and reduced processing time utilizing solid phase diffusion bonding. The fabrication method for this system is provided. The semiconductor devicecomprising: a mounting substrate; a semiconductor chipdisposed on the mounting substrateand a semiconductor substrate, a source pad electrode SP and a gate pad electrode GP disposed on a surface of the semiconductor substrate, and a drain pad electrodedisposed on a back side surface of the semiconductor substrateto be contacted with the mounting substrate; and a source connector SC disposed on the source pad electrode SP. The mounting substrateand the drain pad electrodeare bonded by using solid phase diffusion bonding.

Semiconductor device and fabrication method for the same

A power substrate utilizing silver conductors on ceramic, and the process for making said device. The insulating portion of the substrate is fabricated from a ceramic by placing trenches into the ceramic which can be filled with silver conductors. These conductors can serve the purpose of traces for electrical interconnection, pads for die attachment, as well as thermal conductors for heat pipes and heat spreaders. The conductors can be made on both the top and the bottom of the ceramic. Such substrates may be used for a multitude of applications requiring power substrates for conducting large currents, and are suitable for high efficiency, high temperature, and/or high reliability applications.

Silver filled trench substrate for high power and/or high temperature electronics

A turbine environment wireless transmitter for monitoring bearing health inside jet turbines. This transmitter has the ability to operate in 225 to 300 degree Celsius environments and monitor real time bearing temperature and vibration and transmit that data to a centralized system for processing. The system is powered by a built in thermal electric generator, which produces power in response to a thermal gradient across it. The information transmitted is used to monitor and diagnose a bearing operating parameters in real-time and predict a failure event before any damage occurs.

Autonomous temperature accelerometer sensor

A voltage regulator circuitry () adapted to operate in a high-temperature environment of a turbine engine is provided. The voltage regulator may include a constant current source () including a first semiconductor switch () and a first resistor () connected between a gate terminal (G) and a source terminal (S) of the first semiconductor switch. A second resistor () is connected to the gate terminal of the first semiconductor switch () and to an electrical ground (). The constant current source is coupled to generate a voltage reference across the second resistorA source follower output stagemay include a second semiconductor switch () and a third resistor () connected between the electrical ground and a source terminal of the second semiconductor switch. The generated voltage reference is applied to a gating terminal of the second semiconductor switch ().

Voltage regulator circuitry operable in a high temperature environment of a turbine engine

A circuitry adapted to operate in a high-temperature environment of a turbine engine is provided. A relatively high-gain differential amplifier () may have an input terminal coupled to receive a voltage indicative of a sensed parameter of a component () of the turbine engine. A hybrid load circuitry may be coupled to the differential amplifier. A voltage regulator circuitry () may be coupled to power the differential amplifier. The differential amplifier, the hybrid load circuitry and the voltage regulator circuitry may each be disposed in the high-temperature environment of the turbine engine.

Electronic circuitry for high-temperature environments

A circuitry () adapted to operate in a high-temperature environment of a turbine engine is provided. The circuitry may include a differential amplifier () having an input terminal () coupled to a sensing element to receive a voltage indicative of a sensed parameter. A hybrid load circuitry () may be AC-coupled to the differential amplifier. The hybrid load circuitry may include a resistor-capacitor circuit () arranged to provide a path to an AC signal component with respect to the drain terminal of the switch (e.g.,) of a differential pair of semiconductor switches, which receives the voltage indicative of the sensed parameter.

Hybrid load differential amplifier operable in a high temperature environment of a turbine engine

Chopper circuitry may be adapted to operate in a high-temperature environment of a turbine. A first semiconductor switch () may have a first terminal coupled to receive a first output signal from a first leg () of a differential amplifier (). A second switch () may have a first terminal coupled thru a first resistive element (R) to a second terminal of the first semiconductor switch. The first terminal of the second semiconductor switch may be coupled to receive thru a second resistive element (R) a second output signal from a second leg () of the amplifier. Switches () may be responsive to a switching control signal to respective gate terminals of the switches to supply an output signal, which alternates in correspondence with a frequency of the switching control signal from a first amplitude level to a second amplitude level, which effectively provides a doubling amplification factor.

Chopper circuitry operable in a high temperature environment of a turbine engine

In a telemetry system for use in an engine, a circuit structure () affixed to a moving part () of the engine is disposed for amplifying information sensed about a condition of the part and transmitting the sensed information to a receiver external to the engine. The circuit structure is adapted for the high temperature environment of the engine and includes a differential amplifier () having an input for receiving a signal from a sensor () disposed on the part. A voltage controlled oscillator () with an input coupled to the output of the amplifier produces an oscillatory signal having a frequency representative of the sensed condition. A buffer () with an input coupled to the output of the oscillator buffers the oscillatory signal, which is then coupled to an antenna () for transmitting the information to the receiver.

Wireless telemetry electronic circuitry for measuring strain in high-temperature environments

A circuit assembly () resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board () is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

Wireless telemetry electronic circuit board for high temperature environments

Method for manufacturing a circuit for high temperature and high g-force environments

A circuit assembly () affixed to a moving part () of a turbine for receiving information about a condition of the part and transmitting this information external to the engine. The circuit assembly includes a high-temperature resistant package (A) that attaches to the part. A high temperature resistant PC board () supports both active and passive components of the circuit, wherein a first group of the passive components are fabricated with zero temperature coefficient of resistance and a second group of the passive components are fabricated with a positive temperature coefficient of resistance. The active components are fabricated with high temperature metallization. Connectors () attached to the PC board pass through a wall of the package (A) for communication with sensors () on the part and with an antenna () for transmitting data about the condition of the part to outside the turbine.

Wireless telemetry electronic circuit package for high temperature environments

A circuit affixed to a moving part of an engine for sensing and processing the temperature of the part. The circuit generates a signal representative of the temperature sensed by a thermocouple () and amplified by an amplifier (). A square wave oscillator () with a temperature sensitive capacitor (C) varies its frequency in response to changes of a local temperature of the circuit. A chopper (J) converts the output of the amplifier into an alternating current signal. The chopper is gated by the square wave oscillator and a second input is coupled to an output of the amplifier. Thus, the chopper has an output signal having a frequency representative of the local temperature and an amplitude representative of the thermocouple temperature, whereby the combined signals represent the true temperature of the part.

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West Fork, AR, United States of America

Bryon Western