Honeywell International Inc.

Bryan Seppala

Jon B DCamp

Richard K Spielberger

Max C Glenn

Harlan L Curtis

Jon Dcamp

A microelectromechanical system (MEMS) hermetically sealed package device that is less labor intensive to construct and thus less expensive to manufacture. An example package device includes a package having a bottom section and a lid. A MEMS die includes upper and lower plates made in accordance with upper sense plate design. The MEMS die is mounted to the bottom section. The upper and lower plates form a cavity that receives a MEMS device. The upper and lower plates are bonded by one or more bond pads and a seal ring that surrounds the cavity. The seal ring includes grooves that allow exposure of the cavity to the space within the package. A getter material applied to a top surface of the MEMS die on the upper plate. The getter material is activated during or after the lid is mounted to the bottom section.

Getter on die in an upper sense plate designed system

A method for assembling a hermetically sealed package to contain a MEMS die and the hermetically sealed package are presented. The method includes selectively applying a glass mixture to a dome. The dome is heated to a first temperature sufficient to flow the glass mixture. The dome is pressed into contact with a carrier containing the MEMS device, the pressing being maintained at a pressure and for a temporal interval sufficient to flow the glass mixture onto the carrier. The dome is cooled while maintaining contact with the carrier, to a second temperature sufficient to allow the glass mixture to harden into a glass frit thereby to seal the carrier to the dome. The glass frit has a seal width.

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Mahtomedi, MN, United States of America

Bryan Seppala