Xerox Corporation

Conduent Business Services, LLC

Bryan R Dolan

Peter Johan Nystrom

Bradley James Gerner

John Richard Andrews

Mark Anthony Cellura

Gary Daniel Redding

Pinyen Lin

Antonio DeCrescentis

Lyle G Dingman

John C Handley

Scott J Phillips

John Paul Meyers

Santokh Singh Badesha

Kock-Yee Law

Peter M Gulvin

Fritz F Ebner

Michael F Leo

Terrance Lee Stephens

Hong Zhao

David Paul Platt

Yanjia Zuo

James M Casella

Antonio L Williams

Daniel J Stark

Scott Taylor Treece

Raviteja Gunda

Gregory C Brockway

John P Meyeres

An incident management system in a public transit network receives incident data collected by one or more sensors of the transit network, segments a display screen into multiple cells so that each of the cells corresponds a route segment and a time segment in which one or more vehicles in the transit network traveled, and outputs a graphical representation for each cell. The sensors may be installed on a vehicle to detect various types of incidents such as disturbance, safety and mechanical issues, or any incidents external to the vehicle. The graphical representation may be indicative of the estimated future incident rate for the route segment and the time segment to which each cell corresponds, and displayed by a color scale in a heatmap. The system may estimate the incident rate using a linear model that can be obtained in a training process.

System for public transit incident rate analysis and display

A method of proactively identifying print device incidents for servicing by a service provider may include receiving print device data for one or more print devices, determining a probability value for each of the one or more of the print devices based on the print device data, where each probability value represents a likelihood that the print device will experience a subsequent incident of an incident type within a timeframe, identifying one or more of the print devices associated with probability values that each exceed a threshold value, and for one or more of the print devices that is identified, automatically initiating a service request for the subsequent incident.

Methods and systems for automatically initiating print device service requests using proactive incident detection and analysis

A method and structure for flattening or straightening a curled flexible printed circuit, such as a flexible printed circuit that has been curled during a contact embossing process. The structure can include a cylindrical opening and a support shaft suspended within the cylindrical opening that prevents buckling of the flexible printed circuit during straightening. To flatten the curled flexible printed circuit, the curled end of the flexible printed circuit can be inserted into the cylindrical opening until the curled end is wrapped partially or completely around the support shaft.

Process and structure to uncurl embossed thin flex circuits

A method for forming a printhead including one or more channels. The method can include depositing and selectively sintering a first layer of powder into a sintered layer that forms a first discrete cross-sectional region of a printhead structure for the printhead. A plurality of layers of powder can be sequentially deposited and selectively sintered into a plurality of sintered layers that form discrete cross-sectional regions of the printhead structure and form at least a portion of at least one or more channels. Each of the plurality of layers of powder is deposited directly onto at least one sintered layer. Each of the plurality of sintered layers is integrally bonded to at least one other sintered layer.

Printhead fabrication using additive manufacturing techniques

An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.

Laser welded bonding pads for piezoelectric print heads

A structure and method for a post plate of a die set that can be used to emboss a plurality of contact pads of a flexible printed circuit during the formation of a printer printhead. In one embodiment, a plurality of post plate posts can be formed, where each post plate post has a flat upper surface, generally straight sides, and a sharp corner where the flat upper surface and the generally straight sides intersect. Each post can be polished using, for example, a pad and an abrasive polishing compound or an electrochemical polishing process, to round the sharp corners to form a post having a rounded contour. In another embodiment, a plurality of post plate posts each having a rounded contour can be formed using a molding process.

Structure and method to fabricate tooling for bumping thin flex circuits

In some aspects of the present application, a method of manufacturing a print head is disclosed. The method can include providing a jet stack including an array of jets, bonding an actuator layer to the jet stack, the actuator layer including an actuator array, applying a standoff adhesive layer to the actuator layer and the jet stack, the standoff layer having an array of holes, wherein each hole of the array of holes overlies one of the actuators of the actuator array. A flex circuit layer having an array of bumped contact pads is aligned such that each bumped contact pad aligns with one of the holes of the standoff adhesive. Further, the flex circuit layer is boned to the jet stack layer.

Method for flex circuit bonding without solder mask for high density electrical interconnect

A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers.

Polymer film as an interstitial fill for PZT printhead fabrication

An actuator assembly including a flexible printed circuit and a method for making such an actuator assembly are provided. The flexible printed circuit includes a body having a top side and a bottom side, with the body defining a plurality of bumps extending from the bottom side. A first bump of the plurality of bumps is disposed adjacent to a second bump of the plurality of bumps, and the body further defines at least one relief configured to reduce movement of the second bump caused by movement of the first bump. The flexible printed circuit also includes a plurality of contact pads disposed on the bottom side of the body at least partially at the plurality of bumps, with the plurality of contacts pads being configured to be electrically coupled to a power source and to a piezoelectric transducer.

Reduced mechanical coupling with structured flex circuits

A printhead assembly comprises a plurality of plates stacked together. The plates form a flow path having an inlet and a nozzle. An ejection chamber is in fluid connection with the flow path. A diaphragm is in operable connection with the ejection chamber. A micro actuator is in operable connection with the diaphragm, the micro actuator being configured to actuate the diaphragm. An adhesive layer bonds at least two of the plurality of plates together. The adhesive comprises silicone.

Printhead and method of making the printhead

An ink jet printhead including a substrate such as an ink reservoir or an interposer and a printing device. The printing device can be attached to the substrate with a first adhesive and with a second adhesive that is different than the first adhesive. The second adhesive can be applied to the printing device and to the substrate after attaching the printing device to the substrate with the first adhesive. The second adhesive can seal a gap from an ink channel in the substrate to a location between the printing device and the substrate.

Method and structure for sealing fine fluid features in a printing device

Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto with an adhesive; (b) placing an encapsulant thin film on the piezoelectric transducers; and (c) applying heat, pressure, or a combination thereof to the encapsulant thin film to a degree sufficient to cause the encapsulant to encapsulate the adhesive.

Method for protecting piezoelectric transducer

An ink jet print head including a plurality of standoff layer supports in an interstitial region between adjacent piezoelectric elements, and method of formation. The plurality of standoff layer supports can be formed from the same layer(s) as the piezoelectric elements, or from a dielectric layer such as a polymer. The standoff layer supports increase an area to which a standoff layer can be attached, thereby forming a more secure attachment of a circuit layer such as a flex circuit or a printed circuit board to a jet stack subassembly.

Interstitial material to enable robust electrical interconnect for high density piezoelectric arrays

Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.

Process for adding thermoset layer to piezoelectric printhead

A method and structure for an ink jet print head which includes the use of two or more flexible circuits and a piezoelectric element array. A first pad array is included on a first flex circuit to power a first portion of the piezoelectric element array of the print head, and a second pad array is included on a second flex circuit to power a second portion of the piezoelectric element array of the print head. Using two flex circuits requires only half as many traces to be formed on each flex circuit, which can relax spacing requirements and design tolerances.

Growing community of inventors

Rochester, NY, United States of America

Bryan R Dolan