Intel Corporation

Bryan M White

Paul A Koning

Yuegang Zhang

C Michael Garner

Valluri Ramana Rao

Andrew A Berlin

An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.

Nanotube modified solder thermal intermediate structure, systems, and methods

Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.

Thermal intermediate apparatus, systems, and methods

An apparatus and system, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader. In some embodiments the carbon nanotubes may be formed above a buffer layer formed above a surface of the heat spreader.

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Smyrna, GA, United States of America

Bryan M White