The Geon Company

Bryan M Kazmer

James W Summers

Jerome J Blayne

Compositions, composite articles and process for producing same are provided from a reinforced polyvinyl halide composition (A) comprising a high molecular weight polyvinyl halide resin, a plasticizer, and a reinforcement material, such as glass fibers, in combination with (B) a composition having adhesion to (A). Preferably (B) comprises a thermoplastic compound selected from the group consisting of PVC, plasticized PVC, styrene derivatives, urethane derivatives, acrylic derivatives, acrylonitrile derivatives, polyester derivatives, and mixtures thereof, with the most preferred composition being an unreinforced, plasticized polyvinyl halide composition. The composition article exhibits good strength, low sag at high use temperatures, and lowered coefficient of thermal expansion for use in contact with metal or polymeric substrates such as panels. The composition having a coefficient of thermal expansion not significantly different than the substrates in contact therewith, provides enhanced permanence of adhesion and sag resistance.

Articles from reinforced plasticized polyvinyl halide resin

Compositions, composite articles and process for producing same are provided from a reinforced polyvinyl halide composition (A) comprising a high molecular weight polyvinyl halide resin, a plasticizer, and a reinforcement material, such as glass fibers, in combination with (B) a composition having adhesion to (A). Preferably (B) comprises a thermoplastic compound selected from the group consisting of PVC, plasticized PVC, styrene derivatives, urethane derivatives, acrylic derivatives, acrylonitrile derivatives, polyester derivatives, and mixtures thereof, with the most preferred composition being an unreinforced, plasticized polyvinyl halide composition. The composite article exhibits good strength, low sag at high use temperatures, and lowered coefficient of thermal expansion for use in contact with metal or polymeric substrates such as panels. The composite having a coefficient of thermal expansion not significantly different than the substrates in contact therewith, provides enhanced permanence of adhesion and sag resistance.

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Westlake, OH, United States of America

Bryan M Kazmer