General Electric Company

Sabic Innovative Plastics IP B.v.

General Electric Corporation Gmbh

Bryan Duffey

Gary William Yeager

Kenneth Paul Zarnoch

Michael Alan Vallance

Prameela Susarla

Michael Joseph O'Brien

John Robert Campbell

Amy Rene Freshour

Herbert Shin-I Chao

John Austin Rude

Joop Birsak

Robert Edgar Colborn

Qiwei Lu

Glen David Merfeld

Hugo Gerard Eduard Ingelbrecht

Hugo Gerard Edward Ingelbrecht

Qiwei Liu

A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.

Functionalized poly(arylene ether) composition and method

An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.

Curable encapsulant composition, device including same, and associated method

A thermoplastic composition includes a functionalized poly(arylene ether) and a copolymer of (a) ethylene or an &#x3b1;-olefin, and (b) an alkyl(meth)acrylate. Optional components in the composition include an impact modifier and a flame retardant. The composition is useful for fabricating wire and cable insulation.

Composition comprising functionalized poly(arylene ether) and ethylene-alkyl (meth)acrylate copolymer, method for the preparation thereof, and articles prepared therefrom

A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

Flame-retardant thermoset composition, method, and article

A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

A curable composition includes a functionalized poly(arylene ether); an alkenyl aromatic monomer; an acryloyl monomer; and a polymeric additive having a glass transition temperature less than or equal to 100&#xb0; C. and a Young's modulus less than or equal to 1000 megapascals at 25&#xb0; C. The polymeric additive is soluble in the combined functionalized poly(arylene ether), alkenyl aromatic monomer, and acryloyl monomer at a temperature less than or equal to 50&#xb0; C. The composition exhibits low shrinkage on curing and improved surface smoothness. It is useful, for example, in the manufacture of automotive body panels.

Thermoset composition, method, and article

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Ballston Spa, NY, United States of America

Bryan Duffey