Vlsi Technology, Inc.

Bryan D Schmidt

Pierre Leroux

Anthony Sayka

Stacy W Hall

Edward R Vokoun, Iii

Judy U Galloway

Daniel D Siems

Henry B Taylor, Iii

Discloses is an apparatus and method for cleaning the edges of semiconductor wafers by using a particle withdrawing means having pre-formed, low-tack adhesive material that removes the particles from the edges of the wafers and retains the particles thus removed.

Method and apparatus for removing particles from semiconductor wafer

Method and apparatus for detecting the presence of selected types of defects, such as chemical stains from a liquid photoresist material or a liquid dielectric material, on a non-visible chosen surface of a semiconductor water that has undergone at least one processing step. In one embodiment, a support substrate for, the wafer is provided that has a highly reflecting surface adjacent to the chosen surface. The reflecting surface and the chosen surface are moved apart, and the chosen surface is illuminated with light to form an optical image of the chosen surface. The optical image of the chosen surface is reflected in the reflecting surface, and the reflected optical image is examined for the presence of selected types of defects. In another embodiment, a portion of this reflecting surface is initially contiguous to the chosen surface. A selected defect, if any, on the chosen surface changes a surface characteristic of the reflecting surface so that the presence of this defect on the chosen surface is visually perceptible on the reflecting surface.

Semiconductor wafer defect monitoring

Disclosed herein is an apparatus and method for cleaning the edges of semiconductor wafers by using a particle removing means having an electrostatically charged material. The particles are collected and disposed of so that they do not come in contact again with the clean semiconductor wafers.

Electrostatic apparatus and method for removing particles from

Apparatus and method for reducing heat transfer from a motor to a wafer in a spin-on coating apparatus. The interior of the wafer chuck or spindle is provided with a gap, chamber or void that is either evacuated or is filled with a selected gas or other thermal barrier having low thermal conductivity compared to the wafer chuck material or the spindle material. Optionally, the wafer chuck or the spindle may be provided with a plurality of apertures that allow the gas in the gap to flow to a region outside the wafer chuck or the spindle.

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San Antonio, TX, United States of America

Bryan D Schmidt