Micron Technology Incorporated

Bryan C Carson

Lucien J Bissey

Mark L Hadzor

Scott E Moore

Gordon D Roberts

A method and apparatus for removing layers from a circuit side of a semiconductor die includes the use of a holder, for example a semiconductor wafer having an opening therein for receiving the semiconductor die. Additionally the holder can include one or more layers thereover which are removed at a similar rate as those layers which comprise the semiconductor die. A die is placed into the opening and a circuit side of the die is aligned with a front side of the holder, for example using a generally planar surface, and is secured to the holder with an adhesive material. Using a holder reduces uneven layer removal which is known to occur in conventional processing, for example excessive removal at the edges of the die. A potting jig which aids in aligning and securing the die to the holder is also described.

Semiconductor die de-processing using a die holder and chemical mechanical polishing

An integrated circuit includes a first conductive layer, an insulator layer disposed on the first conductive layer, and a second conductive layer disposed on the insulator layer. A first fuse is disposed in the first conductive layer and provides a first signal, and a second fuse is disposed in the second conductive layer in alignment with the first fuse and provides a second signal.

Methods for forming aligned fuses disposed in an integrated circuit

Methods for forming and programming aligned fuses disposed in an integrated circuit

Methods of processing semiconductor circuits are disclosed. In one embodiment, a method of processing a semiconductor circuit includes isolating a conductive region of the semiconductor circuit from a substrate region of the semiconductor circuit while forming the semiconductor circuit, and connecting the conductive region to the substrate region after the forming of the semiconductor circuit is completed. In alternate embodiments, the isolating and connecting of the conductive and substrate regions may include de-activating and activating a transistor, respectively.

Method and apparatus for isolating a conductive region from a substrate during manufacture of an integrated circuit and connected to the substrate after manufacture

Integrated circuit having aligned fuses and methods for forming and programming the fuses

An integrated circuit includes an enable terminal, a semiconductor substrate, a conductive region, and a transistor. A substrate region is disposed within the substrate, and the conductive region is electrically isolated from both the substrate and the substrate region. The transistor includes a first terminal that is coupled to the substrate region, a second terminal that is coupled to the conductive region, and a control terminal that is coupled to the enable terminal.

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Meridian, ID, United States of America

Bryan C Carson