Stmicroelectronics S.r.l.

Sgs-thomson Microelectronics S.r.l.

Sgsates Componenti Elettronici S.p.a.

Sgs Microelettronica Spa

Sgs-thomson Microelectronics S.p.a.

Sgs-thomson Microelectronics S.a.

Safecertifiedstructure Tecnologia S.p.a.

Is-ates Componenti Elettronici S.p.a.

Safecertifiedstructure Tecnologia S.r.l.

Bruno Murari

Ubaldo Mastromatteo

Alberto Pagani

Benedetto Vigna

Paolo Ferrari

Flavio Francesco Villa

Federico Giovanni Ziglioli

Giulio Ricotti

Marco Morelli

Simone Sassolini

Carlo Cini

Daniele Caltabiano

Sandro Storti

Domenico Giusti

Aldo Torazzina

Franco Bertotti

Pietro Menniti

Fabio Marchio

Roberto Carminati

Enri Duqi

Sarah Zerbini

Marco Ferrera

Sebastiano Conti

Giovanni Girlando

Claudio Diazzi

Alessandro Finocchiaro

Marco Siligoni

Claudio Contiero

Guido Chiaretti

Giuseppe Libretti

Fabio Luigi Grilli

Lorenzo Sarchi

Edoardo Botti

Vanni Poletto

Giovanni Frattini

Angelo Merassi

Andrea Lorenzo Vitali

Roberto Brioschi

Fabrizio Stefani

Caterina Riva

Giampietro Maggioni

Sergio Palara

Luca Zanotti

Mauro Merlo

Luca Seghizzi

Mauro Pasetti

Giuditta Roselli

Franco Cocetta

Silvano Coccetti

Luigi Della Torre

Marco Marchesi

Alessandro Moscatelli

Mohammad Abbasi Gavarti

Giordano Seragnoli

Marco Ronchi

Lucia Zullino

Anna Angela Pomarico

Klaus Rischmuller

Franco Consiglieri

Amedeo Maierna

Andrea Nomellini

Carlo Cognetti De Martiis

Paolo Casati

Massimo Grasso

Giovanni Ghiringhelli

Nazzareno Rossetti

Francesco Ratti

Enrico Novarini

Roberto Toscani

Mario Santi

Giovanni Ghiringelli

Carlo Bozotti

Marco Defazio

Lorenzo Labate

Alberto Alessandri

Alessandro Mariani

Herbert Sax

Giuseppe Mancini

Martina Scolari

Giovanni Degli Antoni

Roberto Bisiani

Anna Pomarico

A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.

Pressure sensing device with cavity and related methods

A method of fabricating a thermoelectric converter that includes providing a layer of a Silicon-based material having a first surface and a second surface, opposite to and separated from the first surface by a Silicon-based material layer thickness; forming a plurality of first thermoelectrically active elements of a first thermoelectric semiconductor material having a first Seebeck coefficient, and forming a plurality of second thermoelectrically active elements of a second thermoelectric semiconductor material having a second Seebeck coefficient, wherein the first and second thermoelectrically active elements are formed to extend through the Silicon-based material layer thickness, from the first surface to the second surface; forming electrically conductive interconnections in correspondence of the first surface and of the second surface of the layer of Silicon-based material, for electrically interconnecting the plurality of first thermoelectrically active elements and the plurality of second thermoelectrically active elements, and forming an input electrical terminal and an output electrical terminal electrically connected to the electrically conductive interconnections, wherein the first thermoelectric semiconductor material and the second thermoelectric semiconductor material comprise Silicon-based materials selected among porous Silicon or polycrystalline SiGe or polycrystalline Silicon.

Method of fabrication of an integrated thermoelectric converter, and integrated thermoelectric converter thus obtained

Displacement transducer device, adapted to be coupled to reference points of a structure, includes a first element integrally securable to a first reference point of the structure, first and second magnets arranged so as to magnetically repel one another, a transducer arranged proximate the first and second magnets so as to detect a variation in the magnetic field between the first and second magnet and to convert the variation into a signal processed by a processing unit, the displacement transducer device includes a second element integrally securable to a second reference point of the structure, and one of the first or second magnet or transducer being connected to the first element and the remaining elements of the first or second magnet or transducer being connected to the second element such that a relative movement of the first or the second reference point causes a variation in the magnetic field.

Displacement transducer device

A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor

A projective MEMS device, including: a fixed supporting structure made at least in part of semiconductor material; and a number of projective modules. Each projective module includes an optical source, fixed to the fixed supporting structure, and a microelectromechanical actuator, which includes a mobile structure and varies the position of the mobile structure with respect to the fixed supporting structure. Each projective module further includes an initial optical fiber, which is mechanically coupled to the mobile structure and optically couples to the optical source according to the position of the mobile structure.

Projective MEMS device for a picoprojector of the flying spot type and related manufacturing method

A tensile stress measurement device is to be attached to an object to be measured. The tensile stress measurement device may include an IC having a semiconductor substrate and tensile stress detection circuitry, the semiconductor substrate having opposing first and second attachment areas. The tensile stress measurement device may include a first attachment plate coupled to the first attachment area and extending outwardly to be attached to the object to be measured, and a second attachment plate coupled to the second attachment area and extending outwardly to be attached to the object to be measured. The tensile stress detection circuitry may be configured to detect a tensile stress imparted on the first and second attachment plates when attached to the object to be measured.

Tensile stress measurement device with attachment plates and related methods

A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.

Integrated pressure sensor with double measuring scale, pressure measuring device including the integrated pressure sensor, braking system, and method of measuring a pressure using the integrated pressure sensor

An integrated electronic device, for detecting for detecting changes in an environmental parameter indicative of an environment surrounding the device, includes: a first conductive element and a second conductive element; a measurement circuit including a first measurement terminal and a second measurement terminal respectively coupled to the first conductive element and the second conductive element. The measurement circuit is configured to provide an electrical potential difference between the first conductive element and the second conductive element is configured to determine a change in an impedance of an electromagnetic circuit including the first conductive element and the second conductive element and formed between the first measurement terminal and the second measurement terminal. The device determines that an increase in a presence of water within the environment has occurred in response to a decrease in a real part of the impedance of the electromagnetic circuit.

Integrated electronic device for monitoring humidity and/or corrosion

A load-sensing device is arranged in a package forming a chamber. The package has a deformable substrate configured, in use, to be deformed by an external force. A sensor unit is positioned in direct contact with the deformable substrate and is configured to detect deformations of the deformable substrate. An elastic element within of the chamber is arranged to act between the package and the sensor unit to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. The deformable substrate may be a base of the package, and the elastic element may be a metal lamina arranged between the lid of the package and the sensor unit. The sensor unit may be a semiconductor die integrating piezoresistors.

Miniaturized load sensor device having low sensitivity to thermo-mechanical packaging stress, in particular force and pressure sensor

An integrated electronic devicefor detecting at least one parameter related to humidity and/or presence of water and/or acidity/basicity of an environment surrounding the device is described. Such devicecomprises a separation layerfrom the surrounding environment, comprising at least one portion of insulating material, and further comprises a first conductive memberand a second conductive member, made of an electrically conductive material, arranged inside the separation layer, with respect to the surrounding environment, and separated from the surrounding environment by the separation layer. The devicealso comprises a measurement module, having two measurement terminals, electrically connected with the firstand the secondconductive members, respectively; the measurement moduleis configured to provide an electric potential difference between the firstand the secondconductive members. The devicefurther comprises electrode means, configured to act as an electrode, arranged outside of the separation layer, with respect to the firstand the secondconductive members; the electrode meansare arranged so as to form, with the firstand the secondconductive members, an electromagnetic circuit having an electromagnetic circuit overall impedance variable based upon the exposure to environmental conditions with a variable level of humidity and/or acidity/basicity. The measurement moduleis configured to measure the electromagnetic circuit overall impedance, which is present between the measurement terminals, and to determine the at least one parameter to be detected, based on the overall impedance measured.

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Monza, Italy

Bruno Murari