Commissariat a L'energie Atomique Et Aux Energies Alternatives

Commissariat a L'energie Atomique

Commissariat a L'energie Atomique Et Aux Energies

Thomson Licensing S.a.

Aledia

Bruno Mourey

Jean Brun

Dominique Vicard

Salim Boutami

Ivan-Christophe Robin

Laurent Frey

Sylvie Menezo

Alexei Tchelnokov

Umberto Rossini

Pierre Gidon

Xavier Hugon

Gunther Karl Haas

François Templier

Christophe Kopp

Yohan Desieres

Thierry Hilt

Guang-Hua Duan

Eric Pourquier

Salvatore Cina

Ludovic Poupinet

Romain Brenot

Alban Le Liepvre

Stéphanie Le Calvez

Eric Fribourg-Blanc

Benoît Lepine

Laurence Mulatier

A filtering device comprising first and second interference filters each comprising a Fabry-Perot cavity formed by semi-reflective layers between which a structured layer is arranged, wherein the structured layer belongs conjointly to the two filters, has a substantially constant thickness, is substantially planar and comprises two materials with different refractive indices arranged in each of the cavities, forming vertical structurings, the cavity of the second filter comprises a spacer arranged between one of the semi-reflective layers and the structured layer so that a distance between the semi-reflective layers of the cavity of the second filter is greater than a distance between the semi-reflective layers of the cavity of the first filter, and the filters comprise a second structured layer arranged in the cavities of the filters, and/or each filter comprises a second Fabry-Perot cavity comprising a third structured layer.

Optical filtering device including Fabry-Perot cavities and structured layer belonging conjointly to first and second interference filters

The present disclosure relates to shaping of optic beams at the inputs/outputs of a photonic chip, the spectral widening of the light coupled to this chip, and a method for manufacturing the chip. The photonic chip includes a light guiding layer supported by a substrate. The chip includes at least one light guiding structure made of silicon coupled on one side to a vertical coupler and on another side to an optical component integrated in the light guiding layer. The photonic chip has a front face on the vertical coupler side and a rear face on the substrate side. A collimation structure of digital lens type is integrated at the level of the rear face to collimate the mode size of the light beam incident on the lens and coming from the vertical coupler.

Photonic chip with integrated collimation structure

A luminous panel includes a substrate having electric connections and an array of microchips secured to the substrate and connected to the electric connections in order to be driven. Each microchip includes control circuit based on transistors formed in a silicon volume, the circuit being connected to the substrate connections, and a micro-LED secured to the control circuit and connected thereto in order to be controlled.

Illuminated faceplate and method for producing such an illuminated faceplate

A distributed device for the detection of a substance is disclosed, comprising: a distributed optical excitation source () including a first optical fiber () having a plurality of extraction regions (), each extraction region () being adapted to extract part of the light carried by the first optical fiber () from said fiber; and a distributed acoustic sensor () including a second optical fiber ().

Distributed device for the detection of a substance

Optical filtering device including fabry-perot cavities comprising first and second structured layers

A photonic chip comprising a light guiding layer supported by a substrate and covered with an encapsulation layer. The chip has a front face on the side of the encapsulation layer and a back face on the side of the substrate. The light guiding layer includes a light guiding structure optically coupled to a vertical coupler configured to receive light from the waveguide and to form a light beam directed towards either the front face or the back face. The chip also comprises a collimation structure formed at least partly in the light guiding layer and an arrangement of one or several reflecting structures each on either the front face or on the back face. This arrangement is made so as to assure propagation of light between the vertical coupler and the collimation structure along an optical path with at least one fold.

Photonic chip with folding of optical path and integrated collimation structure

The invention relates to an optoelectronic device () including: light-emitting diodes (LED) including semiconductor elements (); current-limiting components (), wherein each component is connected in series to one of the semiconductor elements and has a resistance that increases with the strength of the current.

Optoelectronic device and method for manufacturing same

The present invention concerns a method for controlling the emitting wavelength of a laser source () for a passive optical network, the laser source () comprising:

Method for controlling the wavelength of a laser source

Overhead Projector with retractable screen

An unpolarized light beam phase modulator emitting in a given wavelength range comprises at least one cell containing a liquid crystal having a helical structure and means for applying a voltage to said cell, said liquid crystal having a torsion elastic constant greater than its twisting elastic constant so as to ensure continuous stable behavior voltage-wise, said liquid crystal having a sufficient number of turns and in which the axis of the turns is in the light-propagation direction, making it possible to obtain an optical effect generated by the liquid crystal on the electrical field that is identical regardless of the direction of this electrical field, said cell being transparent in said wavelength range.

Phase modulator containing a liquid crystal having a helical structure

An electrode of a light-emitting device of the OLED type adapted for forming with a second electrode, an optical cavity, including at least one layer based on a material of refraction index nincluding a structured face comprising a plurality of recesses filled with a material of refractive index ndifferent from n.

Electrode of a light-emitting device of the OLED type

A wheel includes a tire, an electrical device requiring power for operation, and a conversion system for providing electrical energy for powering the electrical device. The electrical energy is obtained from conversion of a difference between pressure of a gas confined under pressure within the tire and ambient pressure of air outside the tire. The conversion system includes an inlet nozzle fluidly connected to the gas confined under pressure in the tire, an outlet nozzle fluidly connected to the air outside the tire, a movable arm configured to be moved by gas expanding while flowing from the inlet nozzle to the outlet nozzle, and an electromechanical transducer capable of converting mechanical energy from movement of the arm into electrical energy used to power the electrical device.

Wheel with electromechanical conversion system

The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

Method for producing a set of chips mechanically interconnected by means of a flexible connection

A method for fabricating a device provided with one or more cavities filled with at least one liquid, comprising the steps of: (a) forming one or more microcavities on a support separated from each other by one or more walls, and filled with at least one given porous material; (b) filling, in at least one cavity filled with said porous material, by means of at least one given functional liquid; and (c) forming a sealing layer enabling said cavities to be sealed.

Method for producing a retention matrix comprising a functional liquid

A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.

Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure

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Coublevie, France

Bruno Mourey