International Business Machines Corporation

Globalfoundries Inc.

Egypt Nanotechnology Center

Hitachi Global Storage Technologies Netherlands B.v.

Essilor International (compagnie Generale D'optique)

Bruno Michel

Thomas J Brunschwiler

Stephan Paredes

Emmanuel Delamarche

Patrick Ruch

Heinz Schmid

Kerry Bernstein

Hugo Eric Rothuizen

Alexander Bietsch

Harry S Barowski

Andreas Huber

Tim Niggemeier

Hubert Harrer

Jochen Supper

Urs Kloter

Heiko Wolf

Ryan Joesph Linderman

Werner Escher

Javier V Goicochea

Jonas R Weiss

Roger F Dangel

Norbert M Meier

Ryan Joseph Linderman

Peter Vettiger

Emanuel Loertscher

Hans Biebuyck

Chin Lee Ong

Erich M Ruetsche

Rami Ghannam

Mircea R Gusat

Michel Despont

Thomas E Morf

Maria Soimu

Sergey Amontov

Mark Alfred Lantz

Stefano Sergio Oggioni

Willi Volksen

Ashok Lahiri

Heike E Riel

Siegfried Friedrich Karg

Walter Heinrich Riess

Geraud J Dubois

Michael William Chaw

Mauro Spreafico

Giorgio Viero

Mark Clinton Thurber

David Juncker

Sarmenio Saliba

Hans Andre Biebuyck

Andre Bernard

Ahmed S G Khalil

Brian Burg

Paul Stephen Andry

Govindarajan Natarajan

Raschid Jose Bezama

Keiji Matsumoto

Jean-Paul Cano

Takatoshi Tsujimura

Lester W Herron

Sally Ann Swanson

Andreas Christian Doering

Gerd Schlottig

Daniel George Berger

Ian Robson McFadyen

Nikolaj Moll

Gian-Luca Bona

Ronald Peter Luijten

Ingmar G Meijer

Gerhard Keller

Hannes Kind

Matthias Geissler

Urs T Durig

Matthew B Johnson

John Christopher Flake

Jens Oliver Ammann

Richard Stutz

Reto Waelchli

Lukas Novotny

Mark A Lantz

Jean-Philippe M Bourgoin

Sebastien Ragot

Matteo Cossale

Reio Waelchli

Cynthia Gruber

Lars Herrmann

Emanuel Marc Lörtscher

Christian Donzel

J&ouml;ns G Hilborn

Hugo E Rothuizen

Matthias Geisler

Han Biebuyck

An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, a system board configured to be electrically connected to the casing, and upper and lower cards connected to the casing for electrically connecting the casing to the system board.

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

According to certain embodiments, an adsorption heat exchanger (AdHEX) part is provided. The AdHEX part comprises a linear guiding element, and a plurality of planar structures that include fins. Each of the planar structures is: mounted on the linear guiding element via a joint element, the joint element configured to cooperate with the linear guiding element to form a slider joint, coated with an adsorbent coating, and fixed on the linear guiding element, at a respective position, by a fixing means that restricts linear sliding movement of each of the planar structures to form an arrangement of coated planar structures that are stacked along the linear guiding element.

Compact adsorption heat exchangers

A method is presented for predicting heat stroke of a subject. The method includes an earbud covered with a waterproof moisture permeable membrane allowing for moisture penetration, the earbud including an infrared (IR) temperature sensor for measuring core body temperature of the subject, wherein the IR temperature sensor is covered with a waterproof IR transmittable film to inhibit water drops from contacting a detector of the IR temperature sensor, a first humidity sensor positioned within a sweat flow path within the earbud, a second humidity sensor positioned outside the earbud, and a sodium ion (Na) concentration sensor for measuring hydration levels of the subject.

Ear device for heat stroke detection

A porous substrate susceptible to one or both of hydroxylation and alkoxylation by a first protic solvent is exposed to a first relative pressure of the first protic solvent. The porous substrate includes a first plurality of pores having a first average pore diameter and a second plurality of pores having a second average pore diameter that is greater than the first average pore diameter. The first relative pressure is effective to one or both of hydroxylate or alkoxylate substantially only pores of the first average pore diameter to form a first modified porous substrate. The first modified porous substrate is reacted with a first functionalizing reagent that is effective to functionalize one or both of hydroxylated or alkoxylated surfaces, thereby functionalizing substantially only the first plurality of the pores, to form a first functionalized porous substrate.

Selectively functionalized porous material

One or more embodiments of the present invention are directed to a photovoltaic system. The system comprises photovoltaic cells, arranged side-by-side to form an array of photovoltaic cells. It further involves a cooling device, which comprises one or more layers, wherein the layers extend opposite to the array of photovoltaic cells and in thermal communication therewith, for cooling the cells, in operation. The one or more layers are structured such that a thermal resistance of the photovoltaic system varies across the array of photovoltaic cells, so as to remove heat from photovoltaic cells of the array with different heat removal rates, in operation. One or more embodiments of the present invention are further directed to related systems and methods for cooling such photovoltaic systems.

Photovoltaic system with non-uniformly cooled photovoltaic cells

The present invention is notably directed to a photovoltaic module, or PV module, comprising an array of photovoltaic cells, or PV cells, and electrical interconnects. The array of PV cells comprises N portions, N&#x2265;2, where the portions comprise, each, disjoint sets of PV cells of the array. The electrical interconnects connect the PV cells and the N portions of the array so as for PV cells within each of said portions to be electrically connected in parallel and the N portions to be connected in series. The PV cells and the portions are connected, via said interconnects, so to output an electrical current, in operation. The electrical interconnects are otherwise configured to provide electrical signals from each of the N portions. The invention is further directed to related systems and methods of fabrication and operation.

Photovoltaic module

Adsorption heat exchanger devices () are provided for use in solid sorption refrigeration systems () together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules () of the adsorbent material whereby localized bonds () are formed around the contact points on curing of the binder.

Adsorption heat exchanger devices

A method of making integrated adsorption and heat exchanger devices for solid sorption refrigeration systems (). An integrated adsorption and heat exchanger device comprises a solid material having formed therein both a porous adsorption structure, which is pervious to an adsorbate of said system, and a heat exchanger structure, which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system.

Solid sorption refrigeration

A device for converting heat into mechanical energy is disclosed. The device includes a channel flow boiler having at least one channel adapted to heat a working fluid for generating a liquid-gas mixture; an expansion device adapted to expand the liquid-gas mixture; and a movable element arranged such that the expanding liquid-gas mixture at least partially converts an internal and/or kinetic energy of the liquid-gas mixture into mechanical energy associated with the movable element; wherein the channel flow boiler and/or the expansion device is adapted to supply heat to the liquid-gas mixture.

Device and method for converting heat into mechanical energy

An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and including an upper portion formed on a side of the chip, a lower portion formed on another side of the chip, and a cooling inlet and a cooling outlet for transferring a coolant, provided in the casing, and for forming outer sidewalls of the upper portion and inner sidewalls of the lower portion, plural through-wafer vias for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board. The card includes an upper card connected to the upper portion of the casing, and a lower card connected to the lower portion of the casing. Opposing edges of the upper card are located between vertical planes defined by the outer sidewalls of the upper portion of the casing.

An assembly includes a chip including an integrated circuit, a casing including an integrated circuit including plural active elements and including an upper portion formed on a side of the chip, a lower portion formed on another side of the chip, and a cooling inlet and a cooling outlet for transferring a coolant, provided in the casing, and for forming outer sidewalls of the upper portion and inner sidewalls of the lower portion, plural through-wafer vias for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board. The outer sidewalls of the upper portion of the casing are located between vertical planes defined by opposing outer sidewalls of the lower portion of the casing.

An optical sensing device includes a substrate; a first dielectric layer extending thereon; a plurality of pairs of opposite antennas patterned on the first layer; and a second dielectric layer that covers all of the antennas. Opposite antennas are, in each of the pairs, separated by a gap g, which, on average, is between 1 nm and 50 nm, as measured in a direction x parallel to a main plane of the substrate. The pairs of antennas have different geometries. The second layer covers all the antennas and defines an electro-magnetic field enhancement volume between the opposite antennas of each of the pairs, thanks to the gap. Electro-magnetic radiation can be concentrated in each volume, making it possible to optically sense an analyte via opposite antennas of each of the pairs. Such a device allows analytes to be funneled and guided into the field-enhanced volumes for deterministic sensing.

Optical sensing device with multiple field-enhanced nano-volumes

Adsorption heat exchanger devices () are provided for solid sorption refrigeration systems (). Such a device includes a heat exchanger () having a plurality of projections () arranged for extending into an adsorbate of the system () in use. An adsorption structure () is formed on the heat exchanger () for adsorption of said adsorbate. The adsorption structure () comprises a plurality of elongate adsorption elements () extending outwardly from each of said projections () of the heat exchanger ().

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Adliswil, Switzerland

Bruno Michel