Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Bruno Meissner

Dieter Regler

Dietrich Schmidt

Heinz-Jorg Rath

Alfred Moritz

Jurgen Voss

Process for cementing semiconductor discs to a carrier plate for subsequent olishing, which comprises applying to the discs a cementing solution being composed of

Process for cementing semiconductor discs to carrier plates and product

An apparatus and process for cementing semiconductor discs onto a carrier ate, wherein after the carrier plate is coated with a layer of adhesive substance, the discs are applied to the adhesive layer and a vacuum-tight sealing dome is placed over the carrier plate to define a sealed, hollow space. A chemically-inert elastic diaphragm is clamped within the dome 0.2 to 1.5 mm above the free surface of the discs, to divide the hollow space into two sections or subchambers which are initially simulataneously evacuated. Then, air pressure is applied to the upper section, so that the discs are pressed by the diaphragm onto the cement layer. Air pressure is then subsequently fed to the lower hollow space, so that the dome can be removed from the carrier plate.

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Burghausen, Germany

Bruno Meissner