Wacker Siltronic Gesellschaft F&uuml;r Halbleiter Materialien Ag

Bruno Lichtenegger

Thomas Buschhardt

Guido Wenski

Heinrich Hennh&ouml;fer

A process for the surface polishing of a silicon wafer, includes the successive polishing of the silicon wafer on at least two different polishing plates covered with polishing cloth, with a continuous supply of alkaline polishing abrasive with SiO constituents, an amount of silicon removed during the polishing on a first polishing plate being significantly higher than on a second polishing plate, with the overall amount of silicon removed not exceeding 1.5 &mgr;m. A polishing abrasive ( ), then a mixture of a polishing abrasive ( ) and at least one alcohol, and finally ultrapure water ( ) are added to the first polishing plate, and a mixture of a polishing abrasive ( ) and at least one alcohol and then ultrapure water ( ) are added to the second plate.

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Wohnsitz, Germany

Bruno Lichtenegger