Raytheon Company

Bruce William Chignola

Dennis Robert Kling

Boris Solomon Jacobson

Brandon W Blackburn

David J Katz

Jorge M Marcial

Leonard Schaper

Michael V Hynes

Bernard Harris

Donald H Desrosiers

Anthony G Galaitsis

Erik D Johnson

William E Wesolowski

Kenneth A Levenson

Paul F Martin

Timothy M Norcott

Garo Dakessian

Eberhardt Praeger

Christopher D Cotton

Kevin Edward Martin

William Edward Wesolowski

A particle beam detector is disclosed. The particle beam detector can include a particle beam receiving portion configured to convert particle beam energy to heat, and a plurality of temperature measuring devices disposed about the particle beam receiving portion. A location of a particle beam on the particle beam receiving portion can be determined by a temperature difference between at least two of the plurality of temperature measuring devices.

Particle beam detector

Methods and apparatus for a detector system to detect gamma and neutron radiation. In one embodiment, a detector comprises a tank to hold a liquid, a plurality of tubes adjacent the tank to detect neutrons, and a plurality of photon detectors to detect Cherenkov light generated by gamma radiation in the liquid. The tank is configured to contain the liquid so that the liquid generates the Cherenkov light and moderates the neutrons.

Methods and apparatus for integrated neutron/gamma detector

An improved microelectronic assembly () and packaging method includes a device package for housing a semiconductor die or chip, (), an array of passive electronic components (-) operating in cooperation with the flip chip semiconductor die () and housed inside the device package to decouple noise from input signals, and a heat spreader () disposed between a top surface of the semiconductor die () and a package cover (). The semiconductor die () is configured as a flip chip die and the device package includes a package substrate () configured as a ball grid array. The improved microelectronic device () reduces parasitic inductance in electrical interconnections between the semiconductor die and an electrical system substrate () and reduces signal noise in mixed signal high frequency analog to digital converters operating at clock rates above 1 GHz.

Low noise high thermal conductivity mixed signal package

An embedded core electrical transformer () for DC to DC current conversion at a switching frequency of 1 MHz has reduced volume and weight with increased power density. The electrical transformer () utilizes a plurality of conductive elements () disposed inside a hollow cavity () used to embed two magnetic cores (). The conductive elements () encircle three sides of the embedded cores () and interface with a multilayer PCB () which includes conductive traces formed therein to encircle a fourth side of the embedded cores and to form primary and secondary winding circuits.

Fabrication method and structure for embedded core transformers

An electrical transformer having primary winding segments and secondary winding segments interconnected, respectively, by first and second multilevel printed circuit boards disposed in a pair of overlaying planes and additional segments disposed perpendicular to the overlaying planes.

Electrical transformer

The invention provides systems and methods for interconnecting circuit devices, wherein decoupling capacitors are disposed on a substrate and an interconnect layer having a pattern of circuit connections is formed by a deposition process over the capacitors thereby embedding the decoupling capacitors within the interconnect layer. Circuit devices can be mounted to the surface of the deposited interconnect layer at locations that minimize, or substantially minimize, the interconnect length between the chip device and the decoupling capacitors for that circuit device.

Embedded capacitor multi-chip modules

Growing community of inventors

Marlborough, MA, United States of America

Bruce William Chignola