US Government As Represented by the Secretary of the Army

Bruce Robert Geil

Christopher Michael Waits

Timothy J Mermagen

Nicholas Robert Jankowski

Tim Mermagen

A scalable universal power supply and/or power converter provides independent voltage, frequency, phase, and current control through a common power bus connected to a plurality of electrical conversion modules which can provide voltage, frequency, phase, and current control. According to one embodiment, a power supply and/or power converter includes a power bus; a plurality of terminals for input and/or output of electricity; a plurality of electrical conversion modules connected in parallel to the bus for transferring or converting electricity; a switch matrix, formed of a plurality of switches arranged in an array, connecting to the plurality of electrical conversion modules and the plurality of terminals; and a controller configured to select and operate one or more electrical conversion modules and one or more switches of the switch matrix to selectively provide and/or receive electricity to the one or more terminals.

Scalable universal power supply and power converter

A process for forming an integrated multiplex electrospray includes forming multiple holes in a ring extractor substrate to create a ring extractor. A nozzle array having multiple nozzles each nozzle defining a central axis is provided. A spacer layer is bonded to either the ring extractor or the nozzle array to form a bonded stack. The bonded stack is then aligned with remaining layer to align each of the multiple nozzles with one of the plurality of holes to less than 10 microns from concentric and the spacer layer then bonded intermediate between the ring extractor and the nozzle array layer. The spacer layer is then etched to provide fluid communication between multiple nozzles and the multiple holes of the ring extractor and form the spacer.

Process of forming an integrated multiplexed electrospray atomizer

A photolithographed method and pattern for alignment of circuit patterns on double sided opaque substrate or semiconductor such as a silicon wafer during processing of integrated circuits.

Double sided wafer, alignment technique

A method and system for modification of a pattern on a semiconductor subste, comprising the application of an electrical current through a liquid medium having a series of individual pixels controlled by a computer, thereby causing the clear liquid to change to opaque in selected areas.

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Baltimore, MD, United States of America

Bruce Robert Geil