Rogers Corporation

World Properties, Inc.

Bruce G Kosa

Michael E St Lawrence

Richard T Traskos

Scott S Simpson

Murali Sethumadhavan

Allen F Horn, Iii

Vincent R Landi

Mark S Zifcak

Candace G Socha

An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate is formed from a thermosetting composition comprising a polybutadiene or polyisoprene resin; an optional, functionalized liquid polybutadiene or polyisoprene resin; an optional butadiene- or isoprene-containing copolymer; an optional low molecular weight polymer; an optional curing agent; a cross-linking agent; a particulate fluoropolymer; and about 20 to about 50 percent by weight, based on the total weight of the thermosetting composition, of a magnesium hydroxide having a low ionic content. Use of magnesium hydroxide allows the composition to attain a high level of flame retardancy without use of halogenated flame retardants, while maintaining good moisture absorption and other physical properties.

Circuit substrate material, circuits comprising the same, and method of manufacture thereof

A load beam for a suspension assembly comprises a liquid crystal polymer layer disposed between and in intimate contact with a first metal layer and a second metal layer, preferably stainless steel. Such load beams have improved dimensional and hygrothermal stability, as well as greater ease of processing over conventional load beams, allowing tailoring of bend and flex properties.

Liquid crystal polymer disk drive suspension assembly and method of manufacture thereof

The present invention is a liquid crystal polymer suspension assembly. This assembly comprises a stainless steel layer and an electrically conductive layer with a dielectric liquid crystal polymer layer disposed therebetween and bonded thereto. Due to controlled coefficient of thermal expansion, modulus, and very low moisture absorption of the liquid crystal polymer, the suspension assembly of the present invention will have improved dimensional and hygrothermal properties over conventional assemblies, enabling higher density, higher performance assemblies to be produced.

Liquid crystal polymer disk drive suspension assembly

An electroluminescent lamp is presented, wherein at least one of the phosphor layer or the dielectric layer comprises a polyureasilazane polymer. The polyureasilazane may be added to the fluoropolymer resin of the phosphor layer or the dielectric layer, and/or may be used to coat the phosphor particles within the phosphor layer or the inorganic filler particles within the dielectric layer. Use of polyureasilazanes confers enhanced adhesion and environmental resistance.

Electroluminescent lamps having improved interfacial adhesion

A process for forming a contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate that includes the steps of removing a portion of the substrate underlying the contact pad to form an aperture and expose a portion of the bottom surface of the pad; upwardly deforming the pad by applying force to its exposed bottom surface to form the bump; and filling the aperture behind the bump with a supporting substance.

Method of forming contact bumps in contact pads

A connector arrangement for providing electrical interconnection between coresponding contact pads of opposed first and second circuit boards includes an electrically nonconductive support member disposed between the boards, a bodily-rotatable, electrically conductive interconnect element extending through the thickness of the support and having a pair of pad engagement surfaces disposed to engage the respective contact pads, and a clamp for retaining the circuit boards in a clamped-together relationship with the support member in a compressed, reduced thickness state and with the interconnect member bodily rotated. The support member includes resilient elastomeric material, has support surfaces respectively opposed to the board surfaces, and is adapted to be compressed by urging of the boards together. A line projected through the engagement surfaces at the time of their initial engagement upon the contact pads is disposed at an initial, acute angle to the direction of thickness of the support member, and, when being rotated, the same line lies at an acute angle to the direction of thickness of the support greater than the initial angle, the body of the support being locally deformed by the interconnect element and resiliently biasing the interconnect element towards its original position, into engagement with the pads.

Electrical circuit board interconnect

A nylon foam product produced by frothing in an intensive mixer a reaction mixture of catalyst, caprolactam and polyol prepolymer in the presence of a surfactant and gaseous frothing agent.

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Woodstock, CT, United States of America

Bruce G Kosa