Microchip Technology Inc.

Bruce Edward Beauchamp

Joseph D Fernandez

Andrew Tuthill

Anucha Phongsantichai

Samuel E Alexander

Ezana Haile Aberra

David Francis Mietus

Tom Salt

An input voltage range may be established between different voltage levels used for different programming functions of an integrated circuit device, thus implementing a protection zone ('safe zone') of non-operation to facilitate prevention of an unintended irreversible programming operation, e.g., permanent write protection.

Preventing unintended permanent write-protection

An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least two inner leads are connected to at least one of bond pads with a single bond wire. A single bond wire is ball or wedge bonded to a first bond pad or inner lead and subsequently wedge bonded to one or more second bond pads or inner leads, then it is connected to a third or last bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and/or inner lead(s). The bond pad(s) of the die and/or inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

Connecting a plurality of bond pads and/or inner leads with a single bond wire

An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least two bond pads are connected to a one of the plurality of inner leads and/or at least two inner leads are connected to one or more bond pads with a single bond wire. A single bond wire is connected to a first bond pad or inner lead and subsequently wedge or stitch bonded to a second bond pad or inner lead, then it is connected to a third bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and inner lead(s). The bond pad(s) of the die and inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

Single die stitch bonding

An EEPROM having reduced circuit loading of a high voltage write pulse by dividing an array of bit cells into two or more switchable common source segments. Only common source segments containing the bit cells being written to are connected, the other common source segments remain unconnected and do not contribute substantially to loading of the write pulse. Having multiple switchable common segmentations reduces the amount of parasitic capacitance connected in the EEPROM array during a write operation, thus reducing loading on the write circuits. Also reducing the number of bit cells having the common source segments connected during a write operation reduces the amount of leakage current contribution which adversely affects the write operation.

Growing community of inventors

Gilbert, AZ, United States of America

Bruce Edward Beauchamp