Seagate Technology Incorporated

Adc Telecommunications, Inc.

Bruce Charlton Polson

Roger Lee Hipwell, Jr

Peter Crane

Zine-Eddine Boutaghou

Wayne Allen Bonin

Lee Walter

Barry Dean Wissman

Nan Zhang

Howard P Wilson

A microactuator finely positions a transducing head carried by a slider adjacent a select radial track of disc. A frame of the microactuator includes a motor for altering the position of the slider and a closed bonding tub extending upward from the bottom of the microactuator having a bonding surface to engage the top surface of the slider. The closed bonding tub is formed from the microactuator frame such that there is a tub bottom having a bonding surface, sidewalls and an open sidewall.

Bonding tub improved electromagnetic microactuator in disc drives

A disc drive system includes a recording disc rotatable about an axis, a slider carrying a transducing head for transducing data with the disc, an a dual-stage actuation assembly supporting the slider for positioning the transducing head adjacent a selected radial track of the disc. The dual-stage actuation assembly includes a coarsely movable support structure and a microactuator. The microactuator includes a microactuator frame attached to the support structure which includes a stator and a rotor. The rotor is operatively attached to the slider an is movable with respect to the stator in a first horizontal plane parallel to the surface of the disc. A magnetic circuit is arranged to move the microactuator rotor and the slider in the first horizontal plane generally parallel to the surface of the disc, the circuit being partially formed on the microactuator frame and partially formed on the support structure. A plurality of standoffs are provided on the microactuator frame to precisely space the microactuator frame from the support structure.

Microactuator assembly having improved standoff configuration

A microelectromechanical (MEMS) device and a method of fabricating a MEMS device are provided. The method of fabricating the MEMS device includes the steps of: etching a die release trench in a primary handle layer of a wafer having the handle layer, an etch-stop layer disposed on the primary handle layer, and a device layer disposed on the etch-stop layer; patterning a release trench in the device layer that is aligned with the release trench in the primary handle layer; temporarily attaching an additional handle layer to the primary handle layer; etching the device layer to define a structure in the device layer; removing the etch-stop layer; and removing the additional handle layer to release the die.

Method for improved die release of a semiconductor device from a wafer

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New Prague, MN, United States of America

Bruce Charlton Polson