Motorola Corporation

Bruce C Deemer

Timothy B Dean

Daniel T Rooney

A process for reforming a plastic packaged integrated circuit die () includes grinding away () a bottom side () of a plastic package () and portions of a set of leads () that are in the plane of the grinding until a bottom surface () of an inner portion () of the set of leads is exposed at a peripheral region () of the inner portion, cutting () approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting () the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.

Growing community of inventors

Elk Grove Village, IL, United States of America

Bruce C Deemer