Eaton Corporation

Rockwell Automation Technologies Incorporated

Whirlpool Corporation

Other

Bruce C Beihoff

Lawrence D Radosevich

Daniel G Kannenberg

Mark Allan Juds

Jerome Kenneth Hastings

Steven C Kaishian

Dennis L Kehl

Charles J Tennies

Andreas A Meyer

James E Hansen

Mark G Phillips

Neil Gollhardt

Lee A Gettelfinger

Joel Adam Luckman

Michael S Baran

Walter K O'Neil

Francis S Richards, Jr

Nihat O Cur

Peter J Theisen

Richard A Sunshine

Peter K Moldovan

Tao Xie

Kirk Dunsbergen

Richard G Smith

Daniel A Wycklendt

William R Nelson

Karl David McAllister

Colleen Marie Doyle

Tremitchell L Wright

Robert J Clarey

Janice M Kaeding

Michael A Damiano

Timothy A Roebke

Scot Francis Peret

Francis W Camps

Alexander V Minkin

Avie Judes

Mich S Baran

Allen J Slomczewski

An appliance system that includes an appliance group containing at least two appliances, a first appliance designed to perform a first consumer function related to the first appliance and a second appliance that is separate from the first appliance and designed to perform a second consumer function related to the second appliance. The appliance system also includes a thermal energy generator, typically a heat pump, where the thermal energy heats at least one thermal energy bearing fluid and is operably connected to the first and second appliances to deliver thermal energy to the first and second appliances simultaneously or at different times via one or more of the thermal energy bearing fluids.

Heat pump (server) coupled washer and dryer pair

A modular system according to one embodiment of the invention for treating a fabric load comprises a first module and a second module. The first module can include a chamber having an interior for holding a fabric load, and the second module can have at least one of a fluid delivery system, a fluid removal system, and a fluid recycling system. The modular system can further include conduits for coupling the systems of the second module with the first module.

Modular fabric revitalizing system

EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Power converter connection configuration

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Electrical power converter method and system employing multiple output converters

A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Power converter having improved fluid cooling

An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Vehicle drive module having improved cooling configuration

EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Vehicle drive module having improved EMI shielding

A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Cooled electrical terminal assembly and device incorporating same

Power converter having improved EMI shielding

A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Vehicle drive module having improved terminal design

Electrical power converter method and system employing multiple-output converters

An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Compact vehicle drive module having improved thermal control

Modular power converter having fluid cooled support

An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EM/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Fluid cooled vehicle drive module

Growing community of inventors

Wauwatosa, WI, United States of America

Bruce C Beihoff