Motorola Corporation

Bruce Bosco

Steven James Franson

Rudy Michael Emrick

John E Holmes

Stephen Kent Rockwell

A communication device () has an antenna () positioned on a multilayer substrate/printed circuit board ('). A first high frequency material () is disposed over a first side of the substrate () characterized for low frequency devices. A conductive layer () is patterned over the first high frequency material (), defining first and second circuit traces () and first and second antenna traces (). The first and second antenna traces () define a first slot () in the first conductive layer (), which is aligned with a cutout () defined by the substrate (). One of a transmitter () and a receiver () are disposed over the high frequency material () and coupled to the edge emitting antenna () by the first and second circuit traces (). The other of the transmitter () and receiver () may be positioned on the same or opposed side (aligned or staggered) of the substrate () in a similar manner. One or more layers (), which may be patterned to provide resonant features, are formed between the substrate (&#x2032;) for isolation.

High frequency communication device on multilayered substrate

A device () is provided for matching the CTE between substrates (), e.g., a semiconductor substrate and packaging material. The first substrate () has a first coefficient of thermal expansion and the second substrate () has a second coefficient of thermal expansion. At least two layers () of liquid crystal polymer are formed between the first substrate () and the second substrate (), each layer having a unique coefficient of thermal expansion progressively higher in magnitude from the first substrate () to the second substrate ().

Graded liquid crystal polymer package

A packaging structure () is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure () comprises first and second packaging layers () forming a cavity. Two liquid crystal polymer (LCP) layers () are formed between and hermetically seal the first and second packaging layers (). First and second conductive strips () are formed between the LCP layers () and extend into the cavity. An electronic device () is positioned within the cavity and is coupled to the first and second conductive strips ().

Hermetic cavity package

In one embodiment, an improved transceiver assembly for a vehicle capable of detecting potentially hazardous objects is disclosed. The transceiver assembly comprises a tapered slot feed antenna for generating a beam and for detecting the beam as reflected from the potential hazards. The antenna is formed in or on a housing which also contains a parabolic dish that oscillates to sweep the beam of radiation towards the potential hazards outside of the vehicle. In a preferred embodiment, approximately 77 GHz radiation is generated from and detected by the antenna. The antenna is preferably formed on a printed circuit board (PCB) (substrate), which can include additional circuitry necessary to operate the antenna, and which is preferably mounted at an acute angle with respect to the housing to direct the beam at the parabolic dish.

Tapered slot feed for an automotive radar antenna

According to the most preferred embodiments of the present invention, at least one of the two plates of a capacitor is formed in at least two different layers of an integrated circuit. The methods of the present invention uses 'air bridges' or some other dielectric medium to isolate certain portions of the two capacitive plates of a capacitor where at least a portion of one of the capacitive plates passes over at least a portion of the other capacitive plate. The line widths, line separation and number of levels used in the topology of the capacitor will determine the overall capacitance value of a given structure.

Monolithic bridge capacitor

A semiconductor structure includes a monocrystalline silicon substrate, an amorphous oxide material overlying the monocrystalline silicon substrate, a monocrystalline perovskite oxide material overlying the amorphous oxide material, and a monocrystalline compound semiconductor material overlying the monocrystalline perovskite oxide material. A composite transistor includes a first transistor having first active regions formed in the monocrystalline silicon substrate, a second transistor having second active regions formed in the monocrystalline compound semiconductor material, and a mode control terminal for controlling the first transistor and the second transistor.

Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same

An integrated circuit for intermediate impedance matching and stabilization of high power devices is disclosed. High quality epitaxial layers of monocrystalline materials grown over monocrystalline substrates enables the formation of impedance matching and stability circuits to be placed on the same substrate as the active device. Additionally, by using the manifolds of the active to form plates of a capacitor, an impedance matching network of series inductance and shunt capacitor can be compactly fabricated for increasing the output impedance to intermediate levels. The manifolds of the active device are also used to form capacitors to provide stability to high power active devices.

Growing community of inventors

Phoenix, AZ, United States of America

Bruce Bosco