International Business Machines Corporation

Bruce Anthony Copeland

Jun Li Wang

Mark A Takacs

Rebecca Yung Gorrell

Kenneth J Travis, Jr

Lovell B Wiggins

Donald W Scheider

Peter O Ulanmo

A method of forming a lead-free solder alloy on an electronic substrate. In the method, a metal stack which includes a thick nickel barrier layer and an outer copper layer is then evaporated or plated with silver and tin. Upon heating to an appropriate temperature, the copper, tin and silver form a lead-free tin, silver, copper solder.

Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate

A corrosion resistant electrode structure for interconnecting a decoupling capacitor to a substrate is disclosed. In an exemplary embodiment of the invention, the electrode structure includes a first chromium layer formed upon the capacitor and a first nickel layer formed upon the first chromium layer. A noble metal conductive layer is then formed upon the first nickel layer and a second nickel layer is formed upon said noble metal conductive layer. The second nickel layer has a thickness which is greater than a thickness of the first nickel layer. A second chromium layer is then formed upon the nickel layer.

Corrosion-resistant electrode structure for integrated circuit decoupling capacitors

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Wappingers Falls, NY, United States of America

Bruce Anthony Copeland