Delphi Technologies, Inc.

Delco Electronics Corporation

Bruce Alan Myers

Darrel Eugene Peugh

Scott David Brandenburg

Suresh K Chengalva

Carl William Berlin

David W Ihms

Thomas Alan Degenkolb

Arun K Chaudhuri

Jeenhuei S Tsai

Ponnusamy Palanisamy

Todd P Oman

Charles T Eytcheson

John Karl Isenberg

Henry M Sanftleben

Manuel Ray Fairchild

Gary Eugene Oberlin

Dwadasi Hare Rama Sarma

James A Blanton

Christine Redder Coapman

Joseph M Zachman

Steven L Alexander

Clyde E Ragan

Rhonda Jean Heytens

Daniel Keith Ward

Michel Farid Sultan

Dale Lee Partin

Craig Arnold Tieman

Peter James Schubert

Shih-Chia Chang

Dwadasi H Sarma

Erich William Gerbsch

M Ray Fairchild

Joseph M Ratell

Lester Wilkinson

Jeffrey H Burns

Ronnie J Runyon

Eric A Brauer

Thomas S Ellis

Scott E Wilson

Robert H Obremski

William M Maki

Petrina L Schnabel

Joanna Christine Berndt

Glen E Novak

David M Stockero

Timur Akin

Dwadasi Hara Rama Sarma

Anil K Kollipara

Khalid M Eltom

Darrell E Peugh

Bruce Moor

Gary L Eesley

Erich W Gerbsch

Darrel E Peugh

A system for separating carbon dioxide gas from internal combustion engine exhaust and an electricity generating heat exchanger for the system. The system includes a scrubber tank containing a carbon dioxide absorbent fluid and configured to bubble exhaust gas from the heat exchanger through the carbon dioxide absorbent fluid, whereby carbon dioxide gas is absorbed by the carbon dioxide absorbent fluid. A carbon dioxide storage means stores the carbon dioxide released in a heat exchanger. The heat exchanger cools the exhaust gas emitted by the internal combustion engine, and includes a thermal electric generator (TEG) configured to couple thermally the exhaust gas chamber to the absorber fluid chamber in a manner effective to heat the CO2 absorbent fluid by heat from the engine exhaust to release CO2 gas from the CO2 absorbent fluid and generate electricity in response to a temperature difference therebetween.

Heat exchanger equipped with thermal electric device for engine exhaust carbon dioxide collection system

A carbon dioxide storage means stores the carbon dioxide released in a heat exchanger. The heat exchanger cools the exhaust gas emitted by the internal combustion engine, and includes a thermal electric generator (TEG) configured to couple thermally the exhaust gas chamber to the absorber fluid chamber in a manner effective to heat the CO2 absorbent fluid by heat from the engine exhaust to release CO2 gas from the CO2 absorbent fluid and generate electricity in response to a temperature difference therebetween. The CO2 absorbent fluid is one of: a) an aliphatic di-functional nitrile (e.g. pimelonitrile); and b) an oligomeric poly-acrylonitrile (PAN).

Carbon dioxide absorbent fluid for a carbon dioxide sequestering system on a vehicle

A system for separating and storing carbon dioxide (CO2) in exhaust produced by an internal combustion engine. The system uses a scrubber tank containing a carbon dioxide absorbent fluid to capture CO2 in the exhaust. The system also includes a carbon dioxide storage means configured to temporarily store the captured CO2, and a CO2 recovery facility to refine the captured CO2 for future use or prepare the CO2 for permanent storage. The system is intended for installation on vehicles such as automobiles to reduce the amount of CO2 emitted by automobiles into the environment, but could also be used for other applications such as stationary power generators.

Vehicle system to separate and store carbon dioxide from engine exhaust

A thermal-protection apparatus disposed in a vehicle cabin or storage compartment includes a housing enveloping a chamber in which a thermally-sensitive consumer electronic device is received, a thermoelectric module mounted in a wall of the housing, and a remote electronic controller and power source coupled to the housing via an electrical cable for activating the thermoelectric module, and optionally the consumer electronic device, in a manner to prevent the temperature in the chamber from exceeding a prescribed maximum operating temperature of the consumer electronic device or falling below a prescribed minimum operating temperature of the consumer electronic device.

Thermally-protected chamber for a temperature-sensitive consumer electronic device

A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.

Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips

A heat-dissipating component including a heat-generating device such as a power semiconductor chip and a mounting structure is provided with coolant channels having a stair-stepped internal geometry that enhances cooling performance with both single-phase and two-phase cooling modes without unduly restricting coolant flow or significantly increasing manufacturing cost. The stair-stepped geometry enhances both single-phase and two-phase cooling modes by increasing the surface area of the channels, and further enhances the two-phase cooling mode by providing numerous high-quality bubble nucleation sites along the length of the channels. The stair-stepped channels are formed in the heat generating device and/or the mounting structure, and the stepped sidewalls may extend toward or away from the center of the channel.

Heat-dissipating component having stair-stepped coolant channels

A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.

Liquid cooled power electronic circuit comprising stacked direct die cooled packages

A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions formed by a plurality of first ceramic layers and at least one second ceramic layer, respectively, that are superimposed and bonded to each other. Conductor lines are present on at least some of the first ceramic layers so as to be between adjacent pairs of the layers. Electrically-conductive vias electrically interconnect the conductor lines on different first ceramic layers, and a surface-mount IC device is mounted to the substrate. The first ceramic layers are formed of electrically-nonconductive materials, while the one or more second ceramic layers contain thermally-conductive particles dispersed in a matrix of electrically-nonconductive materials, such that the one or more second ceramic layers are more thermally conductive than the first ceramic layers.

Process of forming a laminate ceramic circuit board

A circuit assembly containing a surface mount (SM) IC package wire bonded to a substrate and configured to conduct heat from the package into a heat sink through a heat-conducting member instead of the substrate. The package contains an IC device with input/output pads on a surface thereof that are connected with leads to conductors on the substrate. The heat sink is located adjacent the package so as not to be separated from the package by the substrate. The heat-conducting member is positioned adjacent the surface of the device opposite its input/output pads, and is bonded to the device and heat sink to provide a heat path between the package and heat sink that does not pass through the substrate.

Circuit assembly with surface-mount IC package and heat sink

An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.

Fluid cooled electronic assembly

A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.

Power semiconductor package having integral fluid cooling

The present invention provides a high performance polymer-base material capable of dissipating transient thermal energy generated by an electronic module, such as a heat-generating power device. The methods of the present invention involve adding a suitable thinner to reduce the viscosity and increase the volume of a polymer-base matrix material so that a large amount of thermal absorbing particles may be added. The final cured product may have a filler content of more than 80 weight %. Further, the present invention provides a new and reduced cost formulation of a polymer-base thermal transient suppression material containing organic wax particles.

Thermal transient suppression material and method of production

A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.

Fluid-cooled electronic system

Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an inorganic filler having a platelet geometric structure. The platelet structure of the filler allows a desirable coefficient of thermal expansion to be achieved using a very low level of filler material. This low level of filler material facilitates lower viscosity during forming of the encapsulation and/or overmolding, thereby facilitating complete filling of a mold cavity and underfilling of space between a circuit board and a semi-conductor chip electrically connected to the circuit board. In addition, the low viscosity has processing advantages that reduce the potential for damage to electrical components during encapsulation, overmolding and/or underfilling.

Polymer encapsulated electrical devices

The present invention relates to the cooling of electronic components such as CD or DVD players and recorders and the disc or discs within. Specifically, the present invention relates to the internal cooling of a disc playing or recording device and the disc or discs within.

Vane integration into motor hub to enhance CD cooling

Growing community of inventors

Kokomo, IN, United States of America

Bruce Alan Myers