Air Products and Chemicals, Inc.

Gec, Inc.

Semiconductor Components Industries, LLC

Aspect Systems Inc.

Bruce Alan Huling

George M Engle

Charles Anthony Schneider

Francis J Carney

Stephen St Germain

Ronald James Gibson

In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.

Semiconductor package structure for vertical mount and method

The present invention is a method and apparatus for the dynamic cleaning of semiconductor fabrication equipment and particularly quartzware with thermally activated nitrogen trifluoride wherein the cleaning effluent is safely removed and cleaning by-products isolated or diluted to provide for efficient cleaning and rapid restarts of fabrication equipment so cleaned.

Nitrogen trifluoride thermal cleaning apparatus and process

A method for the dynamic cleaning of semiconductor fabrication equipment and particularly quartzware with thermally activated diluted nitrogen trifluoride at elevated temperatures, typically at the process operation temperature, wherein the cleaning effluent is safely removed and cleaning by-products isolated or diluted to provide for efficient cleaning and rapid restarts of fabrication equipment so cleaned.

Diluted nitrogen trifluoride thermal cleaning process

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Buckeye, AZ, United States of America

Bruce Alan Huling