E.i. Dupont De Nemours and Company

Etd Technology, Inc.

Bruce A Bohnen

Kurt E Heikkila

Rodney Kieth Williams

Rodney K Williams

Russell J Pylkki

The present invention is directed to a hydrogen peroxide solution stabilized by ##STR1## wherein X is a linking group and Y is a metal cation or H which compound is soluble in hydrogen peroxide. In the second aspect of of the invention, a stabilized hydrogen peroxide solution contains a mineral acid which is suitable for etching a metal surface of a metal substrate such as a printed wiring board.

Stabilized hydrogen peroxide compositions

The invention is directed to a hydrogen peroxide solution stabilized by a substituted aminobenzaldehyde compound which is soluble in hydrogen peroxide. The stabilized hydrogen peroxide solution contains a mineral acid which is especially useful for etching a surface of a substrate such as a printed wiring board.

Hydrogen peroxide compositions containing a substituted aminobenzaldehyde

The present invention is directed to a hydrogen peroxide solution stabilized by a substituted oxybenzene compound which is soluble in hydrogen peroxide. In a second aspect of the invention, a stabilized hydrogen peroxide solution contains a mineral acid which is suitable for etching a metal surface of a metal substrate such as a printed wiring board.

Hydrogen peroxide compositions containing a substituted oxybenzene

A method for the preparation of an alkali metal dialkylaminothioxomethyl-thioalkanesulfonate composition comprising reacting a monoamine with carbon disulfide to form a dithiocarbamic acid monoamine salt, reacting the salt with an alkyl sultone to form an amino thioxo methyl thioalkane sulfonate monoamine salt, and sulfonate salt with an alkali metal base to form an alkali metal salt of the amino thioxo methyl thioalkane sulfonate composition.

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Roseville, MN, United States of America

Bruce A Bohnen