Gm Global Technolgoy Operations, Inc.

Brooks S Mann

Terence G Ward

Mark D Korich

George R Woody

Nicholas Hayden Herron

Constantin C Stancu

Gregory S Smith

David Yuang Tang

David H Miller

Edward P Yankoski

Seok-Joo Jang

Douglas S Carlson

David F Nelson

Khiet Le

Marko Jaksic

Daniel J Kaplan

Alan L Barry

Terrence G Ward

Louis Thompson

Cindy Chou

A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.

Power module assembly with reduced inductance

A manifold is provided for supporting a power module assembly with a plurality of power modules. The manifold includes a first manifold section. The first face of the first manifold section is configured to receive the first power module, and the second face of the first manifold section defines a first cavity with a first baseplate thermally coupled to the first power module. The first face of the second manifold section is configured to receive the second power module, and the second face of the second manifold section defines a second cavity with a second baseplate thermally coupled to the second power module. The second face of the first manifold section and the second face of the second manifold section are coupled together such that the first cavity and the second cavity form a coolant channel. The first cavity is at least partially staggered with respect to second cavity.

Power module assemblies with staggered coolant channels

A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.

Low inductance power electronics assembly

Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.

Inverter power module with distributed support for direct substrate cooling

Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

Power electronics substrate for direct substrate cooling

A cooling system is provided for an electric motor and comprises a rotor assembly, an intake assembly, and a first reservoir. The rotor assembly is coupled to and rotatable within a housing, and comprises a rotor having a first and second ends having a first plurality of veins extending therebetween, each vein having an inlet and an outlet. The rotor assembly also comprises a first manifold coupled to and rotatable with the first end of the rotor in fluid communication with the inlets of the first plurality of veins. The intake assembly is coupled to the housing and is in fluid communication with the first manifold. The first reservoir is configured to contain a motor coolant and is coupled to the housing for collecting the motor coolant from the outlets of the first plurality of veins, and for providing a source of motor coolant to the intake assembly.

System and method for cooling an electric motor

A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavity and a second cavity. The second cavity positioned adjacent the power semiconductor device. The first plate further includes an opening to fluidly couple the first cavity with the second cavity such that the liquid coolant flows into the first cavity, through the opening in the first plate, and into the second cavity to cool the power semiconductor device. The first cavity has a cross-sectional area that generally decreases in a downstream direction, and the second cavity has a cross-sectional area that generally increases in the downstream direction.

Cooling systems for power semiconductor devices

A system is provided for detecting when an enclosure having a body and a removable cover is opened. The system comprises a light source for generating a light beam, a light detector for detecting the light beam, and at least one reflector all mounted inside the enclosure. The reflector reflects the light beam along a predetermined pathway toward the light detector when the removable cover is closed over the body.

Growing community of inventors

Redondo Beach, CA, United States of America

Brooks S Mann