Rockwell Automation Technologies Incorporated

Brijeshkumar Meghpara

Juan A Fernandez

David A Figie

Paul Jerome Grosskreuz

Eric Gardner

Ilya Gurevich

Jeffrey William Dujmovic

Kristin N Yee

Eric Krieg

An electronics housing assembly includes a first housing portion and a second housing portion removably connected to the first housing portion to define an interior space that contains electronics components. A first group of the electronics components is connected to the first housing portion and a second group of the electronics components is connected to the second housing portion. A connector alignment and retention panel is connected to the first housing portion. The connector alignment and retention panel includes a connector support platform with a first connector mounting location. A first electrical connector that is part of the first group of the electronics components is operatively engaged with the first connector mounting location of the panel such that the first electrical connector is mounted on the panel and located in a select position relative to the first housing portion. A first corresponding electrical connector that is part of the second group of said electronics components is operatively secured to the second housing portion and is operatively engaged with the first electrical connector mounted on the panel.

Connector alignment and retention panel for modular based system

A cooling system is provided for power conversion circuitry. An intake section of a cooling air channeling element is arranged to direct cooling air through an enclosure, and through or around system components to circuit board-mounted circuitry to be cooled. The element has internal structures, such as deflectors that create local pockets of lower velocity and/or higher pressure air to trap airborne particles that can be evacuated through apertures (e.g., in adjacent plates or mounting structures). The intake section leads to a distribution section that is positioned adjacent to the circuit components to be cooled. The element may have an open bottom that cooperates with surrounding structures to channel the cooling air, facilitating molding of a single-piece element that can be easily mounted during system assembly.

Power conversion equipment cooling with cyclonic airborne particle reduction

An electronics module includes a housing including a wall. A cable clamp chassis projects outwardly from the housing wall. The cable clamp chassis includes first and second cable receiving locations respectively adapted to receive associated first and second cables. A clamp is secured to the cable clamp chassis by a fastener. The clamp is adapted to secure first and second associated cables in the first and second cable receiving locations. The fastener comprises a two-piece structure including a bolt and a head non-rotatably engaged with the bolt. The housing wall is provided as part of a sheet metal wall structure and the cable clamp chassis is cast metal or another monolithic conductive structure. The two-piece fastener comprises a carbon steel or stainless steel bolt and a cast metal or molded polymeric head that is non-rotatably engaged with a bolt head of the bolt.

Cable clamping system for strain relief and grounding

An electronics module includes a cable clamp chassis projecting outward from a wall of the module. The cable clamp chassis includes first and second cable mounting locations adapted to receive respective first and second cables. The cable mounting locations each include an axially extending recess located adjacent a first reference plane. Each of the cable mounting locations includes an inner surface with an innermost point that lies tangent to a second reference plane that is parallel to and offset from the first reference plane such that the first and second cables are arranged in a zero stack configuration. A clamp is secured to the cable clamp chassis and adapted to secure the first and second associated cables in the first and second cable receiving locations.

Growing community of inventors

Germantown, WI, United States of America

Brijeshkumar Meghpara