Deere & Company

Alliance for Sustainable Energy, LLC

Other

Brij N Singh

Thomas J Roan

Neal D Clements

Andrew Dean Wieland

Christopher J Schmit

Kevin Scott Bennion

Gilberto Moreno

Michael J Zurn

Robert K Kinyanjui

Aron Fisk

Brad G Palmer

Tianjun Fu

John N Oenick

Zachary J Wehri

Emily Cousineau

Sagar K Rastogi

Michael L Rhodes

Long Wu

Chris J Tremel

Alan K Gilman

Sumit Dutta

Danielle Li

Jared Lervik

Andrew J Wieland

Advait Desai

Jeff K Hansen

Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

Packaging of wide bandgap power electronic power stages

In accordance with one embodiment is a transformer with a core comprising a perimeter portion and central intervening portion. The central intervening portion is separated from the perimeter portion by air gaps, creating an opening on either side of the intervening portion. A primary winding and secondary winding are wound around the central intervening portion of the core. The primary winding is capable of electromagnetic interaction with the secondary winding. A pair of ferrite members arranged outward from a central axis of the central intervening portion of the core and increases a series inductance with the primary winding. In accordance with another aspect of the disclosure, each ferrite member may have an air gap associated with the core to facilitate heat dissipation from the transformer.

Transformer with integral inductor

Lightweight high-efficiency, high temperature electric drive system is disclosed herein. An example electric drive system including an electric motor including an output shaft. The example electric drive system including power electronics electrically coupled to the electric motor, wherein the power electronic include an inverter. The example electric drive system including a gearbox coupled to the output shaft. The example electric drive system including a first heat exchanger coupled to a surface of the electric motor, the first heat exchanger including coolant. The example electric drive system including a second heat exchanger coupled to a surface of the power electronics, the second heat exchanger including the coolant.

Lightweight high-efficiency, high temperature electric drive system

A system and method of fault detection based on a detailed waveform analysis is presented for transient and steady-state fault operation of 3-Φ DAB converter. Main symptoms of the converter during normal and fault conditions have been identified and a unique pattern in DC bias of phase currents under fault mode is noted. The logic-based fault diagnosis scheme is used to detect the fault and identify the faulty transistor.

Fault detection in a three-phase dab converter

Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.

Condensers and electronic assemblies

A system and method for controlling a dual active bridge based DC/DC converter. A controller implements a startup control scheme and DC bus pre-charge routine to prevent damage to the converter upon startup. During startup of the converter, the startup control process can be used to prevent excessive phase-shift and the DC bus pre-charge routine adjusts the pulse width modulated duty cycle by increasing the dead time between signals, resulting in a decreased DC bus capacitor.

Startup process for a dual active bridge converter to prevent over-voltage failure and thermal run-away

Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

Evaporator stacks and electronic assemblies

A power supply circuit for converting a first voltage to a second voltage where the first voltage is greater than the second voltage, and a power train having the same, are provided. The power supply circuit may have multiple stages and each stage of the power supply circuit may include a first circuit block configured to provide a start-up power to a second circuit block; a second circuit block configured to generate a Pulse-Width-Modulation (PWM) signal that controls a pulse duration of a transistor; a third circuit block configured to activate or deactivate the transistor based on the PWM signal; a fourth circuit block configured to reset a magnetic flux in a transformer to a zero state when the transistor is deactivated; and a fifth circuit block configured to maintain an output of a stage below a predetermined value by adjusting a voltage across the transformer.

Power supply circuit with multiple stages for converting high voltage to low voltage and power train having the same

In accordance with one embodiment, an observed power transfer is estimated based on input and output voltage measurements associated with an observed power transfer from the primary converter to the secondary converter. An electronic controller or electronic data processor determines a ratio or percentage between the observed power transfer and maximum power transfer. A load curve is selected based on the determined ratio or percentage. The modulation frequency is adjusted or maintained for of the primary converter and the secondary converter consistent with an operation point on the selected load curve, where the operation point minimizes the power loss, power difference, or thermal energy dissipated from the converter.

Method and system for controlling a direct current to direct current converter

A semiconductor device comprises a generally planar semiconductor chip. The semiconductor chip comprises a first side and second side opposite the first side. The first side is associated with a source conductive pad. The second side is associated with a drain conductive pad. A gate pad overlies a portion of the first side. A source terminal comprises a metallic strip assembly with a series of pocket chambers spaced apart from each other and partially filled with a phase-change material filling. A drain terminal is spaced apart from the source terminal by a dielectric layer. The source terminal is bonded to the source conductive pad via a bonding interface material.

Packaging of a semiconductor device with phase-change material for thermal performance

A method for manufacturing an electronic assembly features a semiconductor device with a first side and a second side opposite the first side to facilitate enhanced thermal dissipation. The first side has a first conductive pad. The second side has a primary metallic surface. By heating the assembly once, a first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer; and second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Method for manufacturing an electronic assembly

In accordance with one aspect of the disclosure, an electronic assembly comprises a semiconductor device with a first side and a second side opposite the first side. The first side has a first conductive pad. The second side has a primary metallic surface. A first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer. A second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

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West Fargo, ND, United States of America

Brij N Singh