Johnstech International Corporation

Other

Brian Warwick

Jeffrey C Sherry

John E Nelson

Gary William Michalko

Patrick J Alladio

Russell F Oberg

David A Johnson

Sarosh M Patel

Dennis B Shell

Harlan Faller

Daniel A Maccoux

John Bucher

Jay Drescher

Cory R Kostuchowski

Gary W Michalko

The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.

Electrically conductive pins for microcircuit tester

The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.

Electrically conductive pins microcircuit tester

Resilient interposer with electrically conductive slide-by pins as part of a microcircuit tester

The IC test system provides a system and method for thermal management of test pins. A test pin array () in a pin guide () is mounted in a retainer () which is located between an IC wafer () which contains IC devices to be tested (DUT) and a load board () which provides pathways to test signals to the DUT. On the other side of the load board is a contact plate () which together with the retainer straddles the load board. Leg extensions () pass through the load board apertures () and provide a thermal circuit from the contact plate to the retainer and to the pin array. On the upper side of the contact plate is a cooling/heating system with a thermal electric peltier device () and a further heat exchanger () as needed. Holes () are provided in the legs () to provide a supply of dry air to the wafer and pin array to minimize condensation as a result of cooling effects.

Thermal management for microcircuit testing system

The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board including a rocker base protrusion, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.

Microcircuit tester with slideable electrically conductive pins

A test fixture () is disclosed for electrically testing a device under test () by forming a plurality of temporary mechanical and electrical connections between terminals () on the device under test () and contact pads () on the load board (). The test fixture () has a replaceable membrane () that includes vias (), with each via () being associated with a terminal () on the device under test () and a contact pad () on the load board (). In some cases, each via () has an electrically conducting wall for conducting current between the terminal () and the contact pad (). In some cases, each via () includes a spring () that provides a mechanical resisting force to the terminal () when the device under test () is engaged with the test fixture ().

Test contact system for testing integrated circuits with packages having an array of signal and power contacts

A system for testing a microcircuit having a center ground (CG) terminal has an insert for electrically connecting the CG terminal to a ground contact on a load board. The insert is held within a housing by compression and frictional interaction between a resilient projection carried by the insert and a slot in a wall of an aperture holding the insert.

Contact insert for a microcircuit test socket

An actuator device applies force to an integrated circuit package to enable temporary contact between a plurality of contacts on the integrated circuit package and to a set of test contacts carried on a contactor support. A cover is hinged at one side, and rotates to position that allows an actuator element to apply force through a lead backer to the integrated circuit package or its leads, pressing the integrated circuit contacts against the test contacts. A latch opposite to the hinge holds the cover in the closed position. An interlock mechanism may be provided to prevent operating the latch unless the actuator element has withdrawn the lead backer from the integrated circuit or its leads, thereby preventing damage to components.

Single latch manual actuator for testing microcircuits, and having a mechanical interlock for controlling opening and closing

An interface apparatus for reception and delivery of a package from a first location to a second location. The apparatus comprises a nest assembly having an interior defining a nest for receiving a package. The nest is formed by a plurality of sidewalls each having an interior surface, an exterior surface, and an end surface extending between the interior and exterior surfaces. In one embodiment, the interface between the interior surface and the end surface is constructed and arranged having at least a portion of the interface surface substantially conforming to the shape of the angled portion of the leads.

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Ben Lomond, CA, United States of America

Brian Warwick