Other

United Microelectronics Corp.

Brian Wang

Chih-Ching Hsu

Siva Somasundaram

Naim R Malik

The invention is directed to a system and method for automatic discovery of the physical location of at least one device in a data center, the device having an associated ultrasonic emitter. The system generally includes a plurality of ultrasonic detectors having known locations in the data center. A controller initiates the generation of an ultrasonic signal from an ultrasonic emitter associated with a device under test. Time of arrival circuitry generates time of arrival information associated with each ultrasonic detector based on the time of receipt of the ultrasonic signal. The controller determines the location of the device under test based on the known location of the ultrasonic detectors within the data center and the time of arrival information associated with each ultrasonic detector.

System and method for automatic determination of the physical location of data center equipment

A method of planarizing a dielectric layer comprising the steps of providing a substrate having structures already formed thereon, and then forming a borophosphosilicate glass layer over the substrate. Next, a rapid thermal process is applied heating the borophosphosilicate layer to cause a thermal flow, and then the borophosphosilicate layer is etched back so that a planar surface is obtained. Finally, a passivation layer is formed over the borophosphosilicate glass layer to prevent the formation of pits in subsequent pre-metal wet etching operations.

Method of planarizing dielectric layer

A method for manufacturing an even dielectric layer. A substrate having a patterned conductive layer formed thereon is provided. A first dielectric layer with a relatively high dopant dosage is formed on the substrate and the patterned conductive layer. A second dielectric layer with a relatively low dopant dosage is formed on the first dielectric layer. A chemical-mechanical polishing process is formed.

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Chung-Li, Taiwan

Brian Wang