Lockheed Martin Corporation

Brian W Kaplun

David Luverne Vos

James S Eiche

David R Darling

Carl G Baldwin

Michael John Malia

David R Dorough

Dominick Consalvi

Allan O Johnson

James E Bishop

Boris Yost

Steven E McElwain, Jr

Steven E Mcelwain

Mike Malia

Dominick Consalvia

A hinged component fabrication method in which, in a layup stage of fabrication, the component includes a live hinge joining uncured material portions together at a hinge region and comprising a layer of tensile fabric at least partially infiltrated by an uncured elastomer layer at least partially interposed between the tensile fabric and the uncured material portions such that the uncured elastomer blocks the uncured material portions from infiltrating the hinge region. The method may include locating overlapped tensile fabric and elastomer layers in a tool and introducing polymer-based material into the tool such that polymer-based material portions overlap respective opposite ends of the fabric and elastomer layers. The polymer-based material portions are formed to a desired shape using the forming tool so that the fabric and elastomer layers form a live hinge between the polymer-based material portions.

Enhanced composite live hinge

A hinged component includes first and second portions of material coupled together by a composite live hinge. The live hinge includes a layer of tensile fabric and a layer of elastomer interposed between the tensile fabric and the material of one or both of the coupled first and second portions. The composite live hinge is capable of joining structural composite materials without the need for scoring, and thereby weakening, the structural composite material along the desired hinge line. The live hinge can be embedded in the materials it joins in a method that is compatible with traditional structural composite layup processes and in a manner which prevents resin from the structural composite materials from infiltrating the tensile fabric and compromising its flexibility.

Composite live hinge

A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

Process for installing an insert for fluid-flow-through cooling of circuit boards

Process for making an apparatus with fluid-flow-through cooling of circuit boards

Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.

Dimensionally tolerant multiband conformal antenna arrays

Fluid-flow-through cooling of circuit boards

Some embodiments are directed to cooling frames for mezzanine cards, mezzanine card assemblies and circuit card assemblies. A recessed cooling frame may be used to dissipate heat generated by components of a mezzanine card. The cooling frame may be directly coupled to a host card or host card cooling frame, thereby reducing the number of interfaces and reducing the thermal resistance of the heat dissipation pathway. The cooling frames of some embodiments may provide more efficient heat dissipation and thereby allow higher performance mezzanine cards to be used. Some embodiments provide a mezzanine card assembly that conforms to the mechanical envelope dimensions of the VITA 20, VITA 42 or VITA 61 specifications.

High power dissipation mezzanine card cooling frame

A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.

Sensor array packaging solution

Growing community of inventors

Littleton, CO, United States of America

Brian W Kaplun