Qualcomm Mems Technologies, Inc.

Idc, LLC

Brian W Arbuckle

Philip Don Floyd

Ming-Hau Tung

Ion Bita

Mark W Miles

William J Cummings

Lauren Palmateer

Manish Kothari

Brian James Gally

Gang Xu

Lior Kogut

Wen-Jian Lin

Jonathan Charles Griffiths

Patrick F Brinkley

Clayton Ka Tsun Chan

Nassim Khonsari

Sapna Patel

SuryaPrakash Ganti

Jeffrey Brian Sampsell

Evgeni Petrovich Gousev

Teruo Sasagawa

Xiaoming Yan

Illumination devices and methods of making same are disclosed. In one embodiment, a display device includes a light modulating array and a light guide configured to receive light into at least one edge of the light guide. The light guide can be characterized by a first refractive index. The display device can also include a light turning layer disposed such that the light guide is at least partially between the turning layer and the array. The turning layer can comprise an inorganic material characterized by a second refractive index that is substantially the same as the first refractive index.

Illumination devices and methods of fabrication thereof

Illumination devices and methods of making same are disclosed. In one embodiment, an illumination apparatus includes a light source, a light guide having a planar first surface, a first end and a second end, and a length therebetween, the light guide positioned to receive light from the light source into the light guide first end, and the light guide configured such that light from the light source provided into the first end of the light guide propagates towards the second end, and a plurality of light turning features that are configured to reflect light propagating towards the second end of the light guide out of the planar first surface of the light guide, each light turning feature having a turning surface and an interferometric stack formed on the turning surface.

This disclosure provides systems, processes, and apparatus implementing and using techniques for fabricating flexible integrated circuit (IC) device layers. In one implementation, a sacrificial layer is deposited on a substrate. The sacrificial layer can include amorphous silicon or molybdenum, by way of example. One or more electronic components are formed on the sacrificial layer. A polymer coating is provided on the one or more electronic components to define a coated device layer. The sacrificial layer is removed to release the coated device layer from the substrate. The sacrificial layer can be removed using a xenon difluoride gas or by etching, for example. Coated device layers made in accordance with this process can be stacked. The substrate can be formed of glass, silicon, a plastic, a ceramic, a compound semiconductor, and/or a metal, depending on the desired implementation. The electronic component(s) can include a passive component such as a resistor, an inductor, or a capacitor. The electronic component(s) can also or alternatively include an active component such as a transistor.

Flexible integrated circuit device layers and processes

A static interferometric image device including a plurality of solidified liquid layers is formed over a substrate by an inkjet process such that the layers are lateral to one another. In some embodiments, the substrate includes pre-defined cavities, and the liquid layers are formed in the cavities. In other embodiments, the substrate includes a substantially planar, stepped, or continuously transitioning surface, and the solidified liquid layers are formed on the surface. Optical fillers or spacers are provided for defining interferometric gaps between absorbers and reflectors in the display device, based at least partially on an image that the display device is designed to display.

Printable static interferometric images

Methods of fabricating a static interferometric image device and static interferometric image device formed by the same are disclosed. In one embodiment, a method includes providing a substrate. A plurality of liquid layers are formed over the substrate by an inkjet process such that the layers are lateral to one another. The liquid layers contain a solidifiable material or particles. Then, the plurality of liquid layers are solidified to form a plurality of solid layers. In some embodiments, the substrate includes pre-defined cavities, and the liquid layers are formed in the cavities. In other embodiments, the substrate includes a substantially planar, stepped, or continuously transitioning surface, and the liquid layers are formed on the surface. The inkjet process provides optical fillers or spacers for defining interferometric gaps between absorbers and reflectors in the display device, based at least partially on an image that the display device is designed to display.

A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.

Optical interference display panel and manufacturing method thereof

A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Apparatus and method for reducing slippage between structures in an interferometric modulator

A microelectromechanical (MEMS) device includes a functional layer including a first material, a deformable layer including a second material different from the first material, and a connecting element including the first material. The connecting element is mechanically coupled to the deformable layer and the functional layer. The connecting element and the deformable layer form an interface between the first material and the second material. The interface is spaced from the functional layer.

Support structures for free-standing electromechanical devices

Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The packaging system disclosed herein comprises a patterned spacer that, in some embodiments, is fabricated using thin-film methods. In some embodiments, the spacer together with a substrate and backplate package an electronic device.

Device having patterned spacers for backplates and method of making the same

A method for etching a target material in the presence of a structural material with improved selectivity uses a vapor phase etchant and a co-etchant. Embodiments of the method exhibit improved selectivities of from at least about 2-times to at least about 100-times compared with a similar etching process not using a co-etchant. In some embodiments, the target material comprises a metal etchable by the vapor phase etchant. Embodiments of the method are particularly useful in the manufacture of MEMS devices, for example, interferometric modulators. In some embodiments, the target material comprises a metal etchable by the vapor phase etchant, for example, molybdenum and the structural material comprises a dielectric, for example silicon dioxide.

Selective etching of MEMS using gaseous halides and reactive co-etchants

Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket deposited and selectively altered to define sacrificial portions that are selectively removable relative to the remaining portions. Alternatively, a material layer can be laterally recessed away from openings in a covering layer. These methods may be used to make unreleased and released interferometric modulators.

Methods of fabricating interferometric modulators by selectively removing a material

A microelectromechanical (MEMS) device includes a functional layer including a first material and a deformable layer including a second material. The second material is different from the first material. The deformable layer is mechanically coupled to the functional layer at a junction. The functional layer and the deformable layer have substantially equal internal stresses at the junction.

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San Jose, CA, United States of America

Brian W Arbuckle