Meta Platforms Technologies, LLC

Brian Toleno

Michael Nikkhoo

Shobhit Verma

Igor Markovsky

Hunter Cantrell

Yonghua Wei

Vivek Sahu

Patrick Codd

An AR device comprising (1) a frame dimensioned to be worn on a head of a user and (2) a lens stack coupled to the frame and positioned in an optical path of the user such that the user is able to see through at least a portion of the lens stack, wherein the lens stack comprises (A) a lens, (B) an optical waveguide that (I) is configured to display computer-generated content to the user and (II) is at least partially aligned with the lens, and (C) a radio-frequency antenna disposed on the lens. Various other apparatuses, devices, systems, and methods are also disclosed.

Tunable transparent antennas implemented on lenses of augmented-reality devices

A polyimide-based heat pipe is described. In examples, the heat pipe may include a first substrate including raised features on a surface of the substrate. In examples, the first substrate is covered with a second substrate or cover. At least the second substrate comprises polyimide. An outer surface of the heat pipe, e.g., the second substrate, includes one or more antennas disposed thereon.

Heat pipe including an integrated antenna

A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.

Systems and methods for controlling thermal energy between hinged portions of electronic devices

A flexible thermal conduit includes a first material extending along an axial length of the thermal conduit, the first material having a first thermal conductivity, a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity, and a thermally conductive silicone molded over at least a portion of the first material and the second material such that the thermally conductive silicone forms the first end and the second end of the thermal conduit. The thermal conduit may be used in electronic device, such as a wearable device, to transmit heat from a heat source (e.g., a processor) to a thermal ground (e.g., a housing).

Thermal conduit for electronic device

An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. In examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.

Stack-PCB architecture with embedded vapor chamber

A wearable device includes a housing having a cavity and a thermal interposer disposed within the cavity of the housing and thermally coupled to the housing to draw thermal energy from one or more electrical components of the wearable device and to transfer the thermal energy to the housing.

Thermal interposer for electronic device

Thermal hinge system

An electronic device includes an electronic component, a thermal ground, and a thermal interface material having a first side coupled to the electronic component and a second side coupled to the thermal ground, such that the thermal interface material draws thermal energy from the electronic component and transfers thermal energy to the thermal ground. The thermal interface material includes a body comprising thermally conductive silicone, the body disposed in thermal contact with the electrical component, and the thermally conductive silicone having a first thermal conductivity, and a plurality of thermally conductive fibers disposed within the body of the thermal interface material, the thermally conductive fibers having a second thermal conductivity greater than the first thermal conductivity.

Thermal interface material for electronic device

A multi-board system for an electronic device that includes an heat spreader between at least two boards. In examples, the multi-board system may include a stack-PCB architecture on one side of the heat spreader and one or more boards on an opposite side of the heat spreader from the stack-PCB. The heat spreader may comprise a vapor chamber and/or include a graphite layer or core to transfer heat along a length of the heat spreader.

Growing community of inventors

Cupertino, CA, United States of America

Brian Toleno