Intel Corporation

Other

Brian Taggart

Robert M Nickerson

Ronald L Spreitzer

John C Conner

Dale A Hackitt

Saeed S Shojaie

Siuyoung Yao

Hai Ding

In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

Integrated circuit device mounting with folded substrate and interposer

Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present. In accordance with one soldering technique, a method of soldering is accomplished by melting a plurality of braided solder strands to join a plurality of metallic surfaces together.

Braided solder

Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention provide improved power delivery without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention are described in the claims.

Method and apparatus for trace shielding and routing on a substrate

A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact leads; a die mounted onto the paddle portion; wirebonds connected between the die and respective ones of the contact leads; an overmold encapsulating the die, the paddle portion, the contact leads and the wirebonds; and a stiffening element encapsulated in the overmold and unconnected to electrical pathways within the leadframe package.

Microelectronic package having a stiffening element and method of making same

Folded substrate with interposer package for integrated circuit devices

A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package includes coupling the die to the wire-bond pad. A computing system includes the wire-bonding substrate.

Bond finger on via substrate, process of making same, package made thereby, and method of assembling same

A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routing pattern of collector voltage signals.

Power distribution within a folded flex package method and apparatus

A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.

Circular wire-bond pad, package made therewith, and method of assembling same

Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.

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Phoenix, AZ, United States of America

Brian Taggart