Avery Dennison Retail Information Services, LLC

Alcoa Inc.

Brian Strohmeier

Ian J Forster

Norman A Howard

Brad L Cumby

John Feltz

Hu Duan

Cameron Higgins

James Orlowski

Susanne Marie Opalka

Brad Cumby

RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an antenna defining a gap and configured to operate at a first frequency. An RFID chip is electrically coupled to the antenna across the gap. A shielding structure is electrically coupled to the antenna across the gap and overlays the RFID chip. The shielding structure includes a shield conductor and a shield dielectric at least partially positioned between the shield conductor and the RFID chip. The shielding structure is configured to limit the voltage across the gap when the antenna is exposed to a second frequency that is greater than first frequency. In additional embodiments, RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an RFID chip and an antenna electrically coupled to the RFID chip. The antenna may have a sheet resistance in the range of approximately 100 ohms to approximately 230 ohms, optionally with an optical density in the range of approximately 0.18 to approximately 0.29. Alternatively, or additionally, the antenna may be configured to fracture into multiple pieces upon being subjected to heating in a microwave oven. Alternatively, or additionally, the RFID tag may be incorporated in an RFID label that is secured to the package by a joinder material with a greater resistance than that of the antenna, such as a sheet resistance in the range of approximately 100 ohms to approximately 230 ohms.

RFID tags with shielding structure for incorporation into microwavable food packaging

A method of controlling bulk absorption of atomic hydrogen and facilitating degassing of hydrogen from aluminum alloy workpieces during heat treatments in furnaces with ambient and/or moisture-laden atmospheres to prepare for fabrication in sequential working stages, the method includes exposing the surface of the workpieces to an etching process after each or any of the sequential working stages, and subjecting the workpieces to a final etch treatment using an inorganic alkaline or acidic etch solution modified by an addition of five to twenty-five weight percent transition metal chloride salt before being subjected to said heat treatment. The workpieces exposed to the transition metal chloride salt modified etch solution are subjected to the heat treatment. The etch solution is used to substantially decrease the amount of atomic hydrogen entering the bulk of the workpieces and to facilitate removal of atomic and molecular hydrogen from the bulk of the workpieces during the heat treatment.

Modified etching bath for the deposition of a protective surface chemistry that eliminates hydrogen absorption at elevated temperatures

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Pittsburgh, PA, United States of America

Brian Strohmeier