Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Brian S Tsuyuki

Herbert J Tanzer

Darrel W Poulter

Richard B Nelson

Pete Capano

Barry J Oldfield

Peter Gysling

Kenneth T Small

David Johannes Pommerenke

Richard G Sevier

Carl R Haynie

Kenneth K Tang

Kwang Ho Kim

Jon Anson

Alicia G Mercer

Mohammad M Bari

Tanya Schneider

Systems for mounting data storage devices to a chassises are provided. A representative system includes a filler carrier that incorporates a bezel. The bezel including a first snap configured to move between a latched position and an unlatched position. In the latched position, the snap facilitates secure mounting of the filler carrier to a chassis by forming an interference fit with the chassis. In the unlatched position, the snap facilitates removal of the filler carrier from the chassis. The bezel of the filler carrier can be formed as a monolithic structure. Other systems and devices also are provided.

Systems for use with data storage devices

Systems and methods for protecting electronic devices from electrostatic discharge are provided. A preferred system includes a module configured to be received by an enclosure. The module incorporates an electronic component, such as a memory device, processor, and/or circuit assembly, for example, that is configured to electrically communicate with at least a portion of the enclosure when the module is received by the enclosure. The module also includes a first contact portion that is arranged to contact the enclosure as the module is received by the enclosure. Preferably, the first contact portion is formed, at least partially, of a dissipative material. So configured, when the first contact portion engages the enclosure, an electrostatic charge of the module may be discharged in a controlled manner. Methods also are provided.

Systems with enhanced electrostatic discharge protection

Data storage systems are provided. A representative system includes a carrier that incorporates a frame and a cover. The frame includes a faceplate, a first rail and a second rail, with the first and second rails extending outwardly from said faceplate. The first and second rails also are adapted to receive the cover therebetween. Preferably, the cover is configured to at least partially encase a data storage device received by the carrier. Other systems and devices also are provided.

Mounting of data storage devices with compliant storage module covers

Data storage systems are provided. A representative data storage system includes a chassis that is configured to mount at least one data storage device and a carrier. The carrier incorporates a frame and a handle assembly. The frame includes a first and second rails that are spaced from each other and configured to engage opposing sides of a data storage device. Preferably, the first and second rails are formed at least partially of metal for dissipating heat from the data storage device. The handle assembly includes a handle that is configured to move between a latched position and an unlatched position. In the latched position, the handle facilitates secure mounting of the carrier to the chassis. In the unlatched position, the handle facilitates removal of the carrier from the chassis. Other systems and devices also are provided.

Data storage systems with enhanced cooling

Data storage systems are provided. Preferably, a data storage system includes a chassis and a carrier. The chassis is configured to mount at least one data storage device. The carrier incorporates a housing and a handle assembly. The housing is configured to receive at least a portion of a data storage device. The handle assembly includes a handle that facilitates secure mounting of the carrier to the chassis and removal of the carrier from the chassis. Other systems and devices also are provided.

Systems for mounting data storage devices

Systems for mounting electronic components are provided. An exemplary system includes a module that is configured to mount to a chassis at a first pitch. The module incorporates a housing, which is adapted to at least partially encase an electronic component, and spring fingers that are arranged at least partially about an exterior of the housing. The spring fingers are configured to deflect in response to a displacement force so that the module can be mounted to a chassis. The module can be mounted to a first chassis that accommodates a predetermined pitch of modules. In some embodiments, the module also can be mounted at a different pitch. Other systems also are provided.

Systems for mounting electronic component modules

A stabilization mechanism limits rotational vibration in a module enclosure containing plural objects, such as computer disk drives, that produce rotational vibration about a rotational axis. The mechanism includes stabilizer structure coupled to an outer surface of the module enclosure and constructed to transmit a force toward the object that is effective to stabilize the object in the module enclosure. The stabilization mechanism may be formed as first and second spring-loaded contacts that each apply a constant force to the object.

Stabilization mechanism for limiting rotational vibration in a module enclosure

Disk drive carrier

A power distribution unit adapted for mounting within an equipment enclosure including an inner rack. The power distribution unit includes at least one mounting hinge that is fixedly attached to the power distribution unit housing and which is adapted to fixedly mount the power distribution unit to the rack columns. The mounting hinge is pivotable such that the power distribution unit can be pivoted to an extended position to facilitate removal of removable modules of the equipment components mounted within the equipment enclosure.

Growing community of inventors

Roseville, CA, United States of America

Brian S Tsuyuki