Apple Inc.

Brian S Park

Anh T Hoang

Patrick D McNamara

Gregory Stuart Scott

Raman S Thiara

Geertjan Joordens

Kwang M Lee

Meng C Chong

John P Gonzalez

A method and apparatus for power glitch detection in IC's is disclosed. In one embodiment, a method includes a detection circuit in an IC detecting a voltage transient wherein a value of a supply voltage has at least momentarily fallen below a reference voltage value. Responsive thereto, the detection circuit may cause a logic value to be stored in a register indicating that the detection circuit has detected the supply voltage falling below the reference voltage. The IC may include a number of detection circuits coupled to the register, each of which may provide a corresponding indication of detecting the supply voltage falling below the reference voltage. The detection circuits may be placed at different locations, and thus reading the register may yield information indicating the locations where, if any, such voltage transients occurred.

Method and apparatus for power glitch detection in integrated circuits

A self-test loopback apparatus for an interface is disclosed. In one embodiment, a bidirectional interface of an integrated circuit includes a transmitter coupled to an external pin, a first receiver coupled to the external pin, and a second receiver coupled to the external pin. During operation in a test mode, the first receiver may be disabled. The transmitter may transmit test patterns generated by a built-in self-test (BIST) circuit, and compare those test patterns to patterns received by the second receiver. The second receiver may be implemented as a Schmitt trigger (wherein the first receiver may be a standard single-bit comparator). When operating in functional mode, the second receiver may be disabled.

Noise rejection for built-in self-test with loopback

A system and method for testing circuits. A generated input voltage waveform for a first phase of a test may use transitions with a voltage swing between expected low and high trigger points for an integrated circuit (IC) with hysteresis. A generated input voltage waveform for a second phase of the test may use transitions with a voltage swing between the expected low trigger point and a high sub-threshold value. The high sub-threshold value may be a tolerable voltage difference below the expected high trigger point. A generated input voltage waveform for a third phase of the test may use transitions with a voltage swing between the expected high trigger point and a low sub-threshold value. The low sub-threshold value may be a tolerable voltage difference above the expected low trigger point. The expected trigger points and sub-threshold values may be found from earlier characterization studies for the IC.

Method for testing integrated circuits with hysteresis

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San Jose, CA, United States of America

Brian S Park