Intel Corporation

Brian S Jarrett

Stephen R Brown

George H Daskalakis

Craig J Jahne

Neal E Broadbent

Ronald C Flamm

Joseph Andrew Broderick

Paul A Cole

Sanjay Pai

Mark E Sprenger

Barrett M Faneuf

Mark J Gallina

Kuriappan P Alappat

Kenan Huseyin Arik

Richard Christopher Stamey

Aaron P Anderson

Mike G Macgregor

Shankar Krishnan

Jason B Chesser

Thu Huynh

Robert A Eldridge

Mark J Luckeroth

Eric D Mcafee

Juan Gabriel Cevallos Palomeque

Michelle Goeppinger

Geoffrey G Von Allmen

Semiconductor packages including a computing device with a heat source, and related devices and methods, are disclosed herein. For example, the computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source.

Non-planar conforming heatsink

Couplings are disclosed herein. A plug of a coupling includes a plug body and a socket interface coupled to the plug body. The socket interface includes a shoulder extending axially outward from the plug body, a neck extending axially outward and radially inward from the shoulder, and a socket guide extending axially outward and radially outward from the neck.

Universal quick disconnect

Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Expansion card having synergistic cooling, structural and volume reduction solutions

Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Ultrasound assisted immersion cooling

A method and apparatus to manage airflow in a chassis includes one or more airflow restrictor assemblies disposed adjacent a slot within the chassis. The airflow restrictor assemblies can be set in a plurality of positions between a minimum airflow position and a maximum airflow position. The position of the airflow restrictor assembly can be set in accordance with characteristics of the module inserted in the slot. The module characteristics may include power dissipation and airflow resistance.

Method and apparatus to manage airflow in a chassis

A device is disclosed herein for engaging and disengaging electrical connector halves, particularly electrical connector halves mounted on printed assembly boards that are to be electrically connected to a back plane. The device provides a drive train mechanism comprised of a plurality of gears and racks that, when attached, act to reduce the insertion force required to make the electrical connector halves disposed on the printed board assemblies and the back plane. A further aspect of the present invention involves the method of attaching a back plane to at least one stationary printed board assembly by actuation of a drive train.

Method for engaging and disengaging electrical connector halves

Mechanism for engaging and disengaging electrical connector halves

A power supply includes a power cable interface. The power supply also includes an interface guard. The interface guard has an unlocked position and a locked position. When the interface guard is in the unlocked position, the power supply can be attached and detached from a chassis of an electrical system. When the interface guard is in the locked position, the power supply cannot be attached or detached from the chassis of the electrical system. The power cord can only be attached to the power supply while the interface guard is in the locked position.

Locking power cable interface guard

A flexible chassis for a computer system that is adapted to receive computer components of different sizes and configurations. The flexible chassis includes a printed circuit board (PCB) mounting plate that is adapted to receive baseboards of different sizes, a back panel that is adapted to receive different Input/Output (I/O) covers that accommodate the different placement of I/O plugs on different baseboards, a vertical bulkhead having a plurality of different mounting locations for a CPU fan and an I/O fan, and a relocatable PCB support rod assembly adapted to support memory and I/O cards which are coupled to different locations on the various baseboards.

Flexible computer chassis adapted to receive a plurality of different

A floating connector housing has an attachment area for attaching a first connector. The floating connector housing also has two or more flanges for connecting the floating connector housing to a fixed surface. The two or more flanges allow the floating connector to have limited movement within the plane of the fixed surface. The floating connector housing also has one or more alignment pins for aligning the floating connector housing to allow the first connector to couple to a second connector. The floating connector housing can be used to turn a non-floating connector into a floating connector.

Floating connector housing

Growing community of inventors

Hillsboro, OR, United States of America

Brian S Jarrett