Fei Comapny

Brian Routh, Jr

Thomas Gary Miller

Richard J Young

Michael Schmidt

Valerie Brogden

Stacey Stone

Jeffrey Blackwood

Brad Larson

Dhruti Trivedi

Todd Templeton

Aditee Shrotre

Chad Rue

Noel Thomas Franco

John F Flanagan, Iv

James S Clarke

Peter Christiaan Tiemeijer

Bart Jozef Janssen

Jason Harrison Arjavac

Ivan Lazic

Cliff Bugge

Michael Moriarty

Scott Edward Fuller

David Foord

Micah LeDoux

Ivan Lazić

Mark Biedrzycki

Oleg Sidorov

Thomas Miller

Methods and apparatus are disclosed for integration of image-based metrology into a milling workflow. A first ion beam milling operation is performed to an edge at a distance from a final target position on a sample. An SEM image of the sample is used to determine a distance between the milled edge and a reference structure on the sample. Based on the determined distance, the ion beam is adjusted to perform a second milling operation to shift the milled edge to the final target position. Extensions to iterative procedures are disclosed. Various geometric configurations and corrections are disclosed. Manufacturing and analytic applications are disclosed in a variety of fields, including read-write head manufacture and TEM sample preparation. Other combinations of imaging and milling tools can be used.

Microscopy feedback for improved milling accuracy

Methods and systems for implementing artificial intelligence enabled preparation end-pointing are disclosed. An example method at least includes obtaining an image of a surface of a sample, the sample including a plurality of features, analyzing the image to determine whether an end point has been reached, the end point based on a feature of interest out of the plurality of features observable in the image, and based on the end point not being reached, removing a layer of material from the surface of the sample.

Artificial intelligence-enabled preparation end-pointing

Apparatuses and methods directed toward endpoint detection are disclosed herein. An example method at least includes forming a plurality of lines on a top surface of a sample; removing, a plurality of times, material from a working surface of the sample, the working surface different than the top surface; imaging, a plurality of times, the sample to at least capture the plurality of lines; and determining an endpoint based on a relative spatial characteristic between two or more lines of the plurality of lines.

Line-based endpoint detection

The backside of a planar view lamella is prepared from a sample extracted from a workpiece. The sample includes multiple device layers and a substrate layer. After removing at least a part of the substrate layer covering a final device layer to obtain a sample surface, a region of interest (ROI) relative to the sample surface is alternately scanned with an electron beam and spontaneously etched until the final device layer within the ROI is exposed. One or more device layers may be removed from the sample backside after the final device layer is exposed to obtain the backside of the planar view lamella.

Method and system for backside planar view lamella preparation

A method and apparatus for material deposition onto a sample to form a protective layer composed of at least two materials that have been formulated and arranged according to the material properties of the sample.

Method of material deposition

Techniques are described that facilitate automated extraction of lamellae and attaching the lamellae to sample grids for viewing on transmission electron microscopes. Some embodiments of the invention involve the use of machine vision to determine the positions of the lamella, the probe, and/or the TEM grid to guide the attachment of the probe to the lamella and the attachment of the lamella to the TEM grid. Techniques that facilitate the use of machine vision include shaping a probe tip so that its position can be readily recognized by image recognition software. Image subtraction techniques can be used to determine the position of the lamellae attached to the probe for moving the lamella to the TEM grid for attachment. In some embodiments, reference structures are milled on the probe or on the lamella to facilitate image recognition.

Automated TEM sample preparation

A method and apparatus for producing thin lamella for TEM observation. The steps of the method are robust and can be used to produce lamella in an automated process. In some embodiments, a protective coating have a sputtering rate matched to the sputtering rate of the work piece is deposited before forming the lamella. In some embodiments, the bottom of the lamella slopes away from the feature of interest, which keeps the lamella stable and reduces movement during thinning. In some embodiments, a fiducial is used to position the beam for the final thinning, instead of using an edge of the lamella. In some embodiments, the tabs are completed after high ion energy final thinning to keep the lamella more stable. In some embodiments, a defocused low ion energy and pattern refresh delay is used for the final cut to reduce deformation of the lamella.

Preparation of lamellae for TEM viewing

A single column charged particle source with user selectable configurations operates in ion-mode for FIB operations or electron mode for SEM operations. Equipped with an x-ray detector, energy dispersive x-ray spectroscopy analysis is possible. A user can selectively configure the source to prepare a sample in the ion-mode or FIB mode then essentially flip a switch selecting electron-mode or SEM mode and analyze the sample using EDS or other types of analysis.

Source for selectively providing positively or negatively charged particles for a focusing column

A TEM grid provides posts having steps, the steps increasing the number of samples that can be attached to the grid. In some embodiments, each post includes a one sided stair step configuration. A method of extracting multiple samples includes extracting samples and attaching the samples to the different stair steps on the posts.

High capacity TEM grid

The invention relates to a method of preparing and imaging a sample using a particle-optical apparatus, equipped with an electron column and an ion beam column, a camera system, a manipulator. The method comprises the steps of deriving a first ptychographic image of the sample from a first electron image, thinning the sample, and forming a second ptychographic image of the sample. In an embodiment of the invention the seed image used for the second image is the first ptychographic image. In another embodiment the second ptychographic image is the image of the layer removed during the thinning. In another embodiment the inner potential of the sample is determined and dopant concentrations are determined.

Growing community of inventors

Beaverton, OR, United States of America

Brian Routh, Jr