Harris Corporation

Brian Ronald Smith

Charles Michael Newton

Randy T Pike

Paul Bryant Koeneman

Raymond Charles Rumpf

Carol Ann Gamlen

Michael D Pleskach

C Michael Newton

An electro-fluidic device may include a substrate having at least one substrate fluid passageway therein, and at least one substrate electrical conductor carried by the substrate. Moreover, an external interface may be spaced from the substrate and include at least one interface electrical conductor. The electro-fluidic device may also include at least one electro-fluidic interconnect extending between the substrate and the external interface. More particularly, the at least one electro-fluidic interconnect may include an interconnect body having at least one interconnect fluid passageway extending therethrough and connected to the at least one substrate fluid passageway, and at least one interconnect electrical conductor carried by the interconnect body. The at least one interconnect electrical conductor may connect the at least one substrate electrical conductor and the at least one interface electrical connector.

Electro-fluidic device and interconnect and related methods

A method for forming a low temperature cofired ceramic (LTCC) device includes forming a channel in a first LTCC tape layer. A wax is inserted in the channel. The wax is of a type that burns out at a temperature below a sintering temperature of the first LTCC tape layer. At least a second LTCC tape layer is stacked on the first LTCC tape layer to form a stack. The stack is pressed sufficiently for the first and second layers to bond into a laminate. The laminate is fired at the sintering temperature to form a sintered ceramic structure from the first and second LTCC tape layers, so that all or substantially all of the wax is burned out from the channel.

Embedded hermetic cavity formation in low temperature cofired ceramic

A method for making an electronic module includes forming a cooling substrate having a fluid cooling circuit therein having a vertical passageway. The cooling substrate may be formed by forming a plurality of unsintered ceramic layers having passageways therein. The plurality of unsintered ceramic layers and at least one resistive element may be assembled in stacked relation so that the passageways align to define the fluid cooling circuit and so that the at least one resistive element extends in a cantilever fashion into the vertical passageway. Furthermore, the unsintered ceramic layers and the at least one resistive element may be heated to sinter and to cause the at least one resistive element to soften and deform downwardly adjacent vertical sidewall portions of the vertical passageway. The method may also include mounting at least one electronic device on the cooling substrate in thermal communication with the fluid cooling circuit.

Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods

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Indialantic, FL, United States of America

Brian Ronald Smith