The Charles Stark Draper Laboratory, Inc.

Brian R Smith

Bryan McLaughlin

Tirunelveli Subramaniam Sriram

John Lachapelle

Jonathan Jay Bernstein

Jason Oliver Fiering

Maurice S Karpman

Amy Elizabeth Duwel

Douglas W White

Thomas E Boydston

A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.

Method for bonding a hermetic module to an electrode array

Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.

Distributed neuro-modulation system with auxiliary stimulation-recording control units

Methods for bonding a hermetic module to an electrode array

An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.

Bio-implantable hermetic integrated ultra high density device

A method for creating a high density electronic module including the steps of coupling a die to an interposer for form a chipset, mounting the chipset to a substrate, coupling a wafer to the substrate so that the chipset is within a window formed in the wafer, filling the window with encapsulant to encapsulate the chipset, removing the substrate to create a reconstructed wafer, and providing an interconnection structure on the interposer to form the high density electronic module.

Method for embedding a chipset having an intermediary interposer in high density electronic modules

In various embodiments, an inductance of an inductor is tuned by adjusting a position of a conductor and/or a magnetic material with respect to a conducting wire of the inductor, thereby changing the electro-magnetic characteristics of the conducting wire. The conductor and/or magnetic material can be disposed in a microfluidic channel and can be moved within the microfluidic channel using a suitable actuator mechanism.

Inductors having fluidic constructs that permit reconfiguration of the inductors

An interconnect scheme includes a conductive ink forming a plurality of conductive regions, and a dielectric ink occupying spaces between the conductive regions. The conductive ink and the dielectric ink have substantially identical optical, acoustic, and x-ray absorption properties, thereby making the interconnect scheme tamper-resistant and/or difficult to identify and reverse-engineer using conventional detection methods.

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Cambridge, MA, United States of America

Brian R Smith