Intel Corporation

Brian R Peil

Meenakshi Gupta

James W Edwards

Aleksander Magi

Don J Nguyen

Nicholas Waddell Oakley

Russell S Aoki

James Utz

Eduardo Escamilla

Ralph V Miele

Nithyananda Siva Jeganathan

Glen Patrick Gordon

Andrew Larson

Michael Zack Eckblad

Baomin Liu

Daria A Loi

Tongyan Zhai

James M Yoder

Drew G Damm

Nicolas A Kurczewski

Venkat R Gaurav

Ron Flamm

Mark W Anderson

Nicholas R Weber

Ricky O Branner

Michael A Lascu

Eryan Eylon

Dan C Plitt

Ronald B Sutherland

Particular embodiments described herein provide for an electronic system that includes a docking station configured to wirelessly couple to an electronic device and a wireless charging element removably coupled to the docking station. The wireless charging element includes a power receiving unit and is configured to wireless charge the electronic device. In an example, the docking station is configured for high speed input/output.

Docking station

Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.

Mobile device cooling and performance management

A system and method for adaptive thermal and performance management in electronic devices are disclosed. A particular embodiment includes: providing a processor with a plurality of selectable performance levels and a sensor in an electronic device; receiving sensor information from the sensor, the sensor information including information for determining if the electronic device is positioned proximately to an active airflow; determining a device context from the sensor information; and dynamically modifying the performance level of the processor by implementing one of a plurality of selectable performance levels of the processor based on the device context.

System and method for adaptive thermal and performance management in electronic devices

A system to connect cards in a chassis is provided. The system includes a chassis frame having a slot to receive a card. A rocker is coupled to the chassis frame and positioned in a closed state when the card is in the slot. A magnetic element is positioned on the rocker and a sensor positioned to detect a magnetic field generated by the magnetic element. The sensor then determines whether the rocker is positioned an open state or said closed state.

Hot swap system

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Portland, OR, United States of America

Brian R Peil